Stmicroelectronics S.a.

Stmicroelectronics (Crolles 2) Sas

Commissariat a L'energie Atomique Et Aux Energies Alternatives

Rafael Augusto Prieto Herrera

Perceval Coudrain

Jean-Philippe Colonna

A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.

Heat-transferring and electrically connecting device and electronic device

An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.

Growing community of inventors

Grenoble, France

Rafael Augusto Prieto Herrera