Applied Materials, Inc.

Radha Nayak

John M White

Fred Conrad Redeker

Yezdi N Dordi

Brian J Brown

Michael N Sugarman

Madhavi R Chandrachood

Joseph Stevens

Peter W Hey

A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.

Backside etching in a scrubber

Embodiments of the invention generally provide an etchant mixing assembly for a semiconductor processing system. The etchant mixing assembly includes at least one acid source, at least one oxidizer source, a mixing tank selectively in fluid communication with the at least one acid source and the at least one oxidizer source, and a mixed etchant tank in fluid communication with the mixing tank. Additionally, a system controller configured to sense a low level of fluid in the mixed etchant tank, cause a fresh fluid solution to be mixed in the mixing tank, and cause the fresh fluid solution to the communicated to the mixed etchant tank is also provided in the etchant mixing assembly.

Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits

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Santa Clara, CA, United States of America

Radha Nayak