Samsung Electronics Co., Ltd.

Racine Nassau

Tae-Heung Ahn

Jong Min Yoon

Nam Il Koo

Ik Seon Jeon

Ki Wan Seo

In Keun Baek

Su Hwan Park

Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.

Apparatus for measuring wafer

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Gainesville, FL, United States of America

Racine Nassau