Safran

Rabih Khazaka

Toni Youssef

Donatien Henri Edouard Martineau

Stéphane Azzopardi

Pierre Jean Sallot

Minh Chau Phan Huy

Nassim Salhi

Stéphane Joseph Azzopardi

Thanh Long Le

Baptiste Joël Christian Fedi

A method for manufacturing a power electronic module by additive manufacturing includes the step of depositing a layer of an electrically conductive nanoporous material on a substrate that includes an electrically insulating layer and at least one layer of conductive metal material, called a metallized substrate. The method further includes the step of placing an element, for example an active component of the semiconductor power component type, on the layer of nanoporous material and sintering the layer of nanoporous material, so as to ensure a mechanical and electrical connection between said element and the metallized substrate.

Method for manufacturing an electronic power module

The invention relates to a method for manufacturing a power electronic module () by additive manufacturing, characterized in that it comprises the steps of:

Method for manufacturing an electronic power module using polymer preforms

A method for manufacturing a short-circuit protection device, including producing, on a first face of a first substrate, a plurality of first electrically conductive segments; producing, on the first face, a plurality of electrically conductive pads each being in mechanical and electrical contact, through the base thereof, with a single corresponding first segment; producing, on a second face of a second substrate, a plurality of second electrically conductive segments; placing the first face and the second face opposite to each other, to bring a free end of each pad into mechanical and electrical contact with a single corresponding second segment, such that the first segments, the second segments and the pads form a coil.

Method for manufacturing a short-circuit protection device, and associated short-circuit protection device and power module

A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.

Method of fabricating an electronic power module by additive manufacturing, and associated substrate and module

Power electronic module comprising a plurality of semiconductor power electronic components electrically connected to an electrical support, and a cooling device in thermal contact with each component, each component being present between the electrical support and the cooling device and being mounted on the electrical support via at least one electrically conductive spring element.

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Moissy-Cramayel, France

Rabih Khazaka