Intel Corporation

Raanan Sover

Sidharth Dalmia

Helen Kankan Pan

Trang Thuy Thai

Richard S Perry

Omer Asaf

Josef Hagn

Simon Svendsen

Eytan Mann

Rafi Ben-Tal

Eran Gerson

Ravindranath Vithal Mahajan

Michael T Crocker

Je-Young Chang

James D Williams

Bryce D Horine

Igal Kushnir

Sergio Antonio Chan Arguedas

Kuang C Liu

Kyle Jordan Arrington

Ana M Yepes

Kelly P Lofgreen

Shmuel Ravid

Bradley H Smith

Mohamed A Megahed

Jonathan Jensen

Trang Thai

Alexey Chinkov

Paul C George

Nir Peled

Jason Armstrong

Meir Cohen

Jonathan C Jensen

An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Electronic device interconnect

A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

Immersion cooling for integrated circuit devices

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Antenna boards and communication devices

Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

Perpendicular end fire antennas

Embodiments relate to systems methods and computer readable media to enable a wireless communication device are described. In one embodiment a wireless communication device is configured for phased array communications. The wireless communication device comprises radar circuitry to detect objects that scatter a transmit radiated signal from the wireless communication device. Control circuitry is used to adjust the transmit radiated power of the phased array communications based on information provided by the radar circuitry.

Method and apparatus for proximity radar in phased array communications

A computing device includes a body, the body having a first and second portion. The computing device further includes a directional antenna, the directional antenna transmitting a signal having a preferred direction, the directional antenna located in the first portion of the body. The computing device further includes a reflector for reflecting the signal, the reflector located in the second portion of the body, the body having a first configuration where the first portion is aligned with the second portion such that the preferred direction is not aligned to intersect the reflector, the body having a second configuration where the first portion is aligned with the second portion such that the preferred direction is aligned to intersect the reflector.

Device including reflective element to reflect directional wireless signals impinging thereon in a direction away from the device

Some demonstrative embodiments include devices, systems and/or methods of wireless communication via a dual directional antenna. For example, a device may include a hinge to connect between first and second elements to allow rotating the first element between first and second rotational states with respect to the second element, and a rotatable dual directional wireless communication antenna coupled to the hinge. The dual directional wireless communication antenna may be configured to communicate wireless communication signals in a first direction, when the first element is at the first rotational state, and to communicate the wireless communication signals in a second direction, different from the first direction, when the first element is at the second rotational state.

Device, system and method of communicating via a dual directional antenna

Growing community of inventors

Haifa, Israel

Raanan Sover