Avago Technologies Wireless IP (singapore) Pte. Ltd.

Avago Technologies General IP (singapore) Pte. Ltd.

Agilent Technologies, Inc.

R Shane Fazzio

Atul Goel

Richard C Ruby

Michael Louis Frank

David A Feld

Walter J Dauksher

Christopher Wade

Paul D Bradley

Thomas Edward Dungan

Steven Martin

Osvaldo Buccafusca

Joel Philliber

Hongjun Feng

Kristina Lamers

An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.

Multi-frequency acoustic array

Electronic devices and microphone devices are described.

Piezoelectric microphones

A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.

Microcap wafer bonding method and apparatus

An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

Electronic device on substrate with cavity and mitigated parasitic leakage path

A microfluidic case and an electronic device including a microfluidic case are described.

Microfluidic channels and reservoirs in portable electronic devices

Microcap wafer bonding apparatus

An electronic device and transducer structures are described.

Transducers with annular contacts

Transducer structures having multiple piezoelectric layer and annular contacts are described.

Multi-layer transducers with annular contacts

A resonator structure (FBAR) made of electrodes sandwich a piezoelectric material. The intersection of the two conducting electrodes defines the active area of the acoustic resonator. The active area is divided into two concentric areas; a perimeter or frame, and a central region. An annulus is added to one of the two conducting electrodes to improve the electrical performance (in terms of Q).

Thin film bulk acoustic resonator with a mass loaded perimeter

Monolithic devices that include an acoustic resonator vertically integrated with electronic circuitry are described. In one aspect, a monolithic integrated device includes a substrate, electronic circuitry supported by the substrate, an acoustic isolator over the electronic circuitry, and an acoustic resonator on the acoustic isolator. A method of fabricating the monolithic device also is described.

Monolithic vertical integration of an acoustic resonator and electronic circuitry

An improved linear scan geometry laminography system that allows for generation of high speed and high resolution X-ray laminographs using an electronic detector operating in a time-domain integration mode coupled with a moving source of X-rays. In one embodiment, the improved scanning laminography system does not require any mechanical motion of the object being inspected, the X-ray source or detectors. Higher speed is achieved over conventional laminography systems due to the electronic nature of the scan. The same architecture also allows for both two-dimensional radiography and digital reconstruction techniques. Usage of the technique provides for higher throughput, higher resolution, and simpler designs than do currently available systems. An analysis of different system design parameters for the basic X-ray imaging architecture utilizing time-domain integration to generate cross-sectional images is included to facilitate specific design configurations. The relationships between resolution, speed, and cost are considered.

Growing community of inventors

Loveland, CO, United States of America

R Shane Fazzio