Texas Instruments Corporation

R Mark Boysel

James M Florence

Jeffrey Brian Sampsell

Michael A Mignardi

T Gus McDonald

A method for multiple phase light modulation, said method comprising providing a pixel (20) having at least two modulating elements (22), (24). The method further comprising addressing said at least two modulating elements (22), (24) whereby light incident on said addressed element undergoes discrete phase changes between addressable states. The method further comprises resolving light from said at least two modulating elements (22), (24), into a response having at least three unique phases. Other devices, systems and methods are also disclosed.

Multiple phase light modulation using binary addressing

An optical signal processor which employs a coherent light source, two spatial light modulators and a beam splitter. Light is from the source is reflected from the beam splitter and sent to a first spatial light modulator, then sent through the beam splitter, a Fourier transform is performed and the transformed light is then reflected from the second spacial light modulator. The light form the second spacial light modulator is then inverse transformed and returned to the beam splitter where it is reflected to a readout detector. The signal read out is the correlation map between an input image from the first modulator and a filter image of the second modulator.

Optical correlator using light phase modulation and two reflective

A method for producing a vacuum microelectronics device (10) on a substrate (12) and insulating dielectric (14) first forms an electrode base (16) on the insulating dielectric (14). Next, electrode base (16) is covered with a first organic spacer (42) having an aperture (44) for exposing a portion of electrode base (16). Next, a metal layer (46) is applied over organic spacer (42) to form emitter (18) within aperture (44). After removal of organic spacer (42) and metal layer (46), a second organic spacer (44) and a grid material (20) are applied over emitter (18) and electrode base (16). Next, a third organic spacer (50) and an anode metal (22) with access apertures (34) and (36) are placed over the structure. After removing organic spacers (48) and (50), anode metal (22) is sealed with metal (26) to close off access apertures (34) and (36). The result is a vacuum microelectronics device (10) usable is a triode or diode.

Vacuum microelectronics device and method for building the same

A method of forming a vacuum micro-chamber for encapsulating a microelectronics device in a vacuum processing chamber comprises the steps of forming a microelectronics device (14) on a substrate base (30). The next step is to cover microelectronics device (14) with an organic spacer such as photoresist in a form having a plurality of protrusions, such as a star shape form (36). The next step is to cover the organic spacer and substrate base (30) with the metal layer (24) so that the metal layer covers all of the organic spacer except for a predetermined number of access apertures (34) to the organic spacer. Next, the organic spacer is removed through access apertures (34) to cause metal layer (24) to form a shell over a vacuum chamber (20) between the microelectronics device (14) and metal layer (24). The next step is to seal vacuum chamber (20) by coating metal layer (24) and closing off access apertures (34). The method of the present invention has application to produce vacuum micro-diodes and micro-triodes, micro-mass spectrometers, micro-light bulbs, and micro-thermocouple gages, as well as numerous other applications.

Method of forming a vacuum micro-chamber for encapsulating a

A method for producing a vacuum microelectronics device ( 10 ) on a substrate ( 12 ) and insulating dielectric (14) first forms an electrode base (16) on the insulating dielectric (14). Next, electrode base (16) is covered with a first organic spacer (42) having an aperture (44) for exposing a portion of electrode base (16). Next, a metal layer (46) is applied over organic spacer (42) to form emitter (18) within aperture (44). After removal of organic spacer (42) and metal layer (46), a second organic spacer (44) and a grid material (20) are applied over emitter (18) and electrode base (16). Next, a third organic spacer (50) and an anode metal (22) with access apertures ( 34 ) and ( 36 ) are placed over the structure. After removing organic spacers (48) and (50), anode metal (22) is sealed with metal (26) to close off access apertures ( 34 ) and ( 36 ). The result is a vacuum microelectronics device (10) usable is a triode or diode.

Vacuum microelectronics device

An optical switching device with switch elements (224) similar to digital micromirror devices (DMD). The switching element (224) resides in a trench (216) between two elevated areas on the substrate (214a, 214b). Sending and receiving fibers (218a, 218b) face each other across the trench (216) with the switch element (224) between them. When the switch is ON, light travels through lenses (220a, 220b) in the trench (216) from one fiber (218b) to the other (218a). When the switch is flipped OFF, the element (224) is activated and blocks the light from the sending fiber (218b) by reflecting or absorbing the light from the sending fiber (218b). The switch is activated and possibly deactivated by addressing electrodes (226a, 226b) under the element (224), which deflects through an air gap towards the activated electrode (226b). For better deflection angles the posts can be arranged closer to one end of the element than the other. An alternate hinge architecture is also provided.

Architecture for optical switch

A method for multiple phase light modulation, said method comprising providing a pixel (20) having at least two modulating elements (22),(24). The method further comprising addressing said at least two modulating elements (22), (24) whereby light incident on said addressed element undergoes discrete phase changes between addressable states. The method further comprises resolving light from said at least two modulating elements (22), (24), into a response having at least three unique phases. Other devices, systems and methods are also disclosed.

Methods of forming multiple phase light modulators

Vacuum micro-chamber for encapsulating a microelectronics device

There is disclosed a device that consists of a micro-mechanical switch consisting of an electrode, a gap between the electrode and an individually deflectable element, which has a vertical shutter attached to its underside. When the electrode is addressed the movement of the deflectable element causes the shutter to raise or lower. Such a device can be used in switching. One embodiment of such a use in waveguides is disclosed along with the method of manufacture.

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Plano, TX, United States of America

R Mark Boysel