Kemet Electronics Corporation

R Allen Hill

Reggie Phillips

John Bultitude

John E McConnell

Garry L Renner

Galen W Miller

Maurice Perea

Philip Michael Lessner

Keith Brown

James B Byrd

A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.

Method of forming a leadless stack comprising multiple components

An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.

Leadless stack comprising multiple components

A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:

Method for stacking electronic components

A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

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Simpsonville, SC, United States of America

R Allen Hill