Sandisk Technologies Inc.

Micron Technology Incorporated

Sandisk Corporation

Qui V Nguyen

Jonathan Huynh

Feng Q Pan

Jong Hak Yuh

Tai-Yuan Tseng

Yen-Lung Li

Chang Hua Siau

Khin Htoo

Kenneth Louie

Trung Pham

Yuxin Wang

Albert Chang

Michele Piccardi

Seungpil Lee

Raul Adrian Cernea

Kwang-Ho Kim

Cynthia Hsu

Jixin Yu

Khanh Vinh Nguyen

Jongmin Park

Ohwon Kwon

Takuya Ariki

Anirudh Amarnath

Manabu Sakai

Alexander Chu

Steve Choi

Arka Ganguly

Feng Pang

A microelectronic device comprises blocks, contact structures, filled vias, and a base structure. The blocks each have a vertically alternating sequence of conductive structures and insulative structures arranged in tiers. Each block comprises a forward staircase structure and a reverse staircase structure. The contact structures are on steps of the forward staircase structure of a first of the blocks and on additional steps of the reverse staircase structure of a second of the blocks horizontally neighboring the first of the blocks. The filled vias extend through portions of the first of the blocks within horizontal boundaries of the reverse staircase structure of the first of the blocks and extend through portions of the second of the blocks within horizontal boundaries of the forward staircase structure of the second of the blocks. The base structure underlies the blocks and comprises transistors coupled to the filled vias.

Microelectronic devices including staircase structures, and related memory devices and electronic systems

Memory having an array of memory cells and a plurality of access lines each connected to a respective plurality of memory cells of the array of memory cells might include a controller configured to cause the memory to apply a respective programming pulse having a first target voltage level and a first pulse width to each access line of a first subset of access lines of the plurality of access lines, and apply a respective programming pulse having the first target voltage level and a second pulse width longer than the first pulse width to each access line of a second subset of access lines of the plurality of access lines, wherein each access line of the first subset of access lines is nearer a particular end of the string of series-connected memory cells than each access line of the second subset of access lines.

Memory cell programming including applying programming pulses of different pulse widths to different access lines

Apparatuses, systems, methods, and computer program products are disclosed for an on-die capacitor. A memory chip comprises an array of memory cells. A capacitor is electrically coupled to an array of memory cells. A capacitor receives at least a portion of discharged electricity from an operation for an array of memory cells. A capacitor supplies electricity back to an array of memory cells during a subsequent operation for an array of memory cells.

On-die capacitor for a memory device

Disclosed includes a memory device and a method of operating the memory device. A voltage is applied to a word line coupled to first memory transistors of a first plurality of strings of transistors and second memory transistors of a second plurality of strings of transistors. A current flow through one or more of the first plurality of strings of transistors is enabled, while applying the voltage to the word line. A current flow through the second plurality of strings of transistors is disabled by floating source terminals and drain terminals of the second memory transistors, while enabling the current flow through the one or more of the first plurality of strings of transistors.

Select gates separation for improving performance in three-dimensional non-volatile memory

This disclosure provides techniques for reducing leakage current in a non-volatile memory that does not include a local interconnect. In one example, a low-voltage pulse can be applied to all of the word-lines in all of the blocks of the non-volatile memory. The low-voltage pulse can be applied during a period in which the row decoder is typically idle in order to reduce the total amount of time required to program the non-volatile memory. After the conclusion low-voltage pulse, a global control line voltage can be applied at about the same level as the low-voltage pulse to keep the word-lines floating when the pulse is no longer applied.

Word-line pre-charging in power-on read operation to reduce programming voltage leakage

This disclosure provides a method and apparatus for applying a dynamic strobe signal to a plurality of sense modules during programming of an array of memory cells, where a characteristic of the dynamic strobe signal is configured to limit a peak current level through the plurality of sense modules. An example apparatus the array of memory cells, a plurality of bit lines spanning the array of memory cells, and the plurality of sense modules connected to the bit lines. The plurality of sense modules enable sensing of states of memory cells. A controller determines the characteristic of the dynamic strobe signal, where the dynamic strobe signal is varied based on the determined characteristic.

Loop control strobe skew

Apparatuses, systems, and methods are disclosed for three-dimensional non-volatile memory. A stack of word line layers includes word lines for a three-dimensional non-volatile memory array. A stack of word line layers may include a plurality of tiers. Word line switch transistors transfer word line bias voltages to the word lines. Word line contact regions couple word line switch transistors to word lines. A word line contact region includes a stepped structure for a tier of word line layers. A level region separates a word line contact region for a first tier from a word line contact region for a second tier.

Word line contact regions for three-dimensional non-volatile memory

Systems and methods for reducing sensing time for sensing data states stored within a plurality of memory cells are described. In some cases, the ramping of a word line connected to the plurality of memory cells may be delayed until a threshold current corresponding with a particular number of erased memory cells of the plurality of memory cells has been met or exceeded. The threshold current may be compared with a summation of a first set of detection currents corresponding with a first set of memory cells of the plurality of memory cells that have been sensed to be in a conducting state while the word line is set to a voltage level for sensing erased memory cells. The threshold current may be set based on a chip temperature and/or a particular number of bit errors that occurred during a prior sensing operation.

Fast scan to detect bit line discharge time

Apparatuses, systems, and methods are disclosed for accessing non-volatile memory. A bit line is coupled to storage cells for a non-volatile memory element. A sense amplifier is coupled to a bit line. A sense amplifier includes a sense circuit and a bias circuit. A sense circuit senses an electrical property of a bit line for reading data from one or more storage cells, and a bias circuit applies a bias voltage to the bit line for writing data to one or more storage cells. A bias circuit and a sense circuit comprise separate parallel electrical paths within a sense amplifier.

Sense amplifier with program biasing and fast sensing

Methods for controlling a ramp rate of an output voltage derived from one or more charge pumps and reducing variation in the ramp rate due to process, voltage, and temperature (PVT) variations are described. In some embodiments, the ramp rate of the output voltage from one or more charge pumps may be controlled using a ramp rate control circuit that uses a digital counter to adjust (or step up) the output voltage from the one or more charge pumps based on a ramp rate schedule. The ramp rate schedule may specify varying output voltage levels for the one or more charge pumps during a time period in which the output voltage charges up from a first voltage to a second voltage greater than the first voltage.

Digital ramp rate control for charge pumps

A charge pump system is formed on an integrated circuit that can be connected to an external power supply. The system includes a charge pump and a clock generator circuit. The clock circuit is coupled to provide a clock output, at whose frequency the charge pump operates and generates an output voltage from an input voltage. The clock frequency is a decreasing function of the voltage level of the external power supply. This allows for reducing power consumption in the charge pump system formed on a circuit connectable to an external power supply.

Clock generator circuit for a charge pump

A charge pump system can provide multiple regulated output levels, including several concurrently, in an arrangement that can reduce the area and power consumption of such a high voltage generation system. The charge pump system can be dynamically reconfigurable based on output requirements. When output level is low, but required for a large AC, DC load, the system is configured in parallel to share the load. When a higher output is required, such as for a programming in a non-volatile memory, the system is configured in serial to generate the desired high output level. The exemplary embodiment uses all of the pump units in each operation and, hence, is able to be optimized for smaller pump area and less power consumption, while still delivering the same pump ability as larger, more power consuming arrangements.

Charge pump system dynamically reconfigurable for read and program

A charge pump system uses a dynamic switching approach, where the pump connections are independent of the load for each output. One large pump is designed to be shared between all of the outputs for use during the ramp up during recovery, with each output level also have one designated pump to maintain its level when under regulation. Each small pump is designed with capability that can maintain its output at its regulation level. Each of these pumps can be tailored to the corresponding output level, such as the number of stages being higher in the pump to supply the higher output level. The large pump unit is constructed to be ample to provide sufficient drive to be able to assist in the ramp up phase for all of the outputs and has as many switches needed to connect the pump with all the needed outputs.

Dynamic switching approach to reduce area and power consumption of high voltage charge pumps

A regulator system for a charge pump system divides the binary decoding into two branches. One controls a set of parallel connected resistors for fine output voltage steps. The other branch controls a serial resistor to provide the large step size. For example, a 9-bit digital input signal is split into 2 least significant for the fine adjustment and the other 7 bits for the larger adjustments. In the example of a 50 mV step size, in one current path 2 bits of the binary input then control two parallel resistors for 50 mV and 100 mV step size, and in the other current path 7 bits are used for one-hot-decode control serial resistors to provide a 200 mV step size. A unity gain operational amplifier and a high voltage device are added in between the two branches to decouple the parasitic capacitance of large parallel resistors from the other elements.

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San Jose, CA, United States of America

Qui V Nguyen