Delta Electronics, Inc.

Delta Electronics (shanghai) Co., Ltd

Quansong Luo

Haijun Yang

Wenhua Li

Shaohua Zhu

Xiangxing Zheng

Yuanyuan Dan

Kun Jiang

Xi Liu

Jianxin Chen

Kaijian Yang

Yanbing Xia

Yanggui Feng

Liang Jin

A power module and a manufacturing method are provided. The power module includes a first electronic assembly and a second electronic assembly. The first electronic assembly includes at least one pin. The second electronic assembly includes a first surface and a second surface opposite to each other. The first surface is more adjacent to the first electronic assembly than the second surface. A direction from the first surface toward the second surface is defined as a reference direction. The second electronic assembly includes a first region and a second region. The first region has a first thickness in the reference direction. The second region has a second thickness in the reference direction. The second thickness is less than the first thickness. The second region includes at least one through hole. The pin is penetrated through the at least one through hole and fixed on the second electronic assembly.

Power module and manufacturing method thereof

A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

Method for forming power module package, power module package and electronic device

The present disclosure discloses an inductor structure mounted on a PCB board and a voltage regulator module having the same. The inductor structure includes an inductor core and an inductor winding. The PCB board is provided with at least one hollow part, and the inductor structure further comprises a plurality of copper strips used as the inductor windings of the inductor structure. The copper strips are spaced apart in the hollow part so as to form a plurality of through holes, and the leg of the inductor core is correspondingly inserted into the through hole at the corresponding position of the hollow part.

Inductor structure mounted on PCB board and voltage regulator module having the same

The present disclosure discloses an inductor structure mounted on a PCB board and a voltage regulator module having the same. The inductor structure includes inductor cores and inductor windings. The PCB board is provided with at least one hollow part, and the hollow part comprises a plurality of through holes spaced apart. The legs of the inductor cores are correspondingly inserted into the through holes at the corresponding positions of the hollow part, wherein any two adjacent through holes of the plurality of through holes have a spacer therebetween for use as the inductor winding of the inductor structure, and the thickness of the spacer is less than the thickness of the PCB board.

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Shanghai, China

Quansong Luo