Boe Technology Group Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Quanqin Sun

Ang Xiao

Fuyi Cui

Xu Chen

Xiaodong Yang

Song Zhang

Shuai Zhang

Qin Qiong Zhang

Xiangnan Wang

Duanming Li

Chao Ma

Yangyang Zhang

Jingjing Chen

Fujiang Jin

Guanyu Lu

Guowei Li

Zhiqiang Gao

Hyunchel Shin

Hyun Chel Shin

Minghao Gao

Baoke He

Guanjun Huang

Qin Zhang

Hongjian Wu

Provided are a light-emitting device and a manufacturing method thereof, and a display device, and relates to the field of display technology. The light-emitting device includes: a light-emitting unit located on one side of a backplane; and an encapsulation layer located on one side of the light-emitting unit away from the backplane. The encapsulation layer includes: a first inorganic layer; a second inorganic layer located on one side of the first inorganic layer away from the backplane; an organic layer located between the first inorganic layer and the second inorganic layer; and a third inorganic layer located between the first inorganic layer and the organic layer. The refractive index of the first inorganic layer, the refractive index of the third inorganic layer, and the refractive index of the organic layer decrease sequentially.

Light-emitting device with improved luminous efficiency and manufacturing method thereof, and display device

An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

Encapsulation method of display panel, display panel, and display device

The present disclosure provides an OLED panel, an OLED packaging method, and a display panel. The OLED panel includes a substrate; an OLED element on a surface of the substrate; an inorganic cover layer on the substrate and the OLED element, the inorganic cover layer being configured to cover a peripheral portion of the surface of the substrate; a bonding layer on the inorganic cover layer; and a barrier layer on the bonding layer, wherein a portion of the bonding layer on the peripheral portion includes at least one rib configured to form an airtight space for isolating the OLED element from the external.

OLED panel having OLED element sealed therein, OLED packaging method for sealing OLED element, and display panel

A manipulator arm includes at least one arm body for carrying a to-be-carried object. The arm body is provided with a suction plate for sucking the to-be-carried object, and the suction plate is provided with a plurality of vacuum suction holes. The plurality of vacuum suction holes are uniformly distributed in the entire suction plate.

Manipulator arm, manipulator and carrying device

The present disclosure discloses a display panel motherboard, a method of manufacturing a display panel, and a display apparatus. The display panel motherboard includes a first substrate and a second substrate provided opposite to each other. The first substrate has a plurality of first zones and a plurality of second regions, each of the plurality of first zones has a first display region and a first packaging material pattern on a periphery of the first display region, each of the plurality of second zones has a second packaging material pattern, and the second packaging material pattern is at at least one side of the first packaging material pattern facing away from the first display region.

Display panel motherboard, method of manufacturing display panel, and display apparatus

An encapsulation method and an encapsulation device are provided. The encapsulation method comprises: forming a binding agent in an encapsulation region of a display substrate; forming an organic thin film on the binding agent; exerting a pressure on the organic thin film and the binding agent by using a pressure exerting device, wherein the organic thin film is not bound to the pressure exerting device; removing the organic thin film; and providing a cover plate on the binding agent and binding the cover plate with the display substrate by the binding agent.

Encapsulation method and encapsulation device

A packaging structure for an OLED device is provided. The packaging structure includes a plurality of films coated on an outer side of the OLED device and comprising alternately stacked inorganic layers and organic layers, wherein both a film in contact with the OLED device and a film farthest from the OLED device are inorganic layers, wherein the inorganic layer in contact with the OLED device comprises at least two sub-films sequentially stacked, and wherein a contact angle between i) a material for forming a sub-film of the at least two sub-films that contacts an organic layer and ii) an organic material for forming the organic layer is smaller than a preset angle.

Packaging structure for OLED device and display apparatus

The present disclosure provides a method of packaging an OLED apparatus, an OLED packaging apparatus and a display device, and relates to the field of the OLED. The method includes steps: forming a first inorganic thin film layer on an OLED to be packaged; forming a groove on a surface of the first inorganic thin film layer; forming a second organic thin film layer within the groove; and forming a third inorganic thin film layer covering the first inorganic thin film layer and the second organic thin film layer.

Method for packaging organic light-emitting diode apparatus, organic light-emitting diode packaging apparatus and display device

Growing community of inventors

Beijing, China

Quanqin Sun