Rockwell Collins, Inc.

Qizhou Matthew Yao

Ross Keith Wilcoxon

Nathan P Lower

Ryan Legge

David W Dlouhy

John A Chihak

A heat transferring method and system utilizing a parasitic phase-change pump is disclosed. The parasitic phase-change pump is utilized to circulate a working fluid. The method may include: facilitating heat transfer from at least one evaporator to a condenser via the working fluid; receiving and containing the working fluid from the condenser utilizing an expandable MEMS device; controlling and regulating the flow of the working fluid from the expandable MEMS device towards the at least one evaporator utilizing at least one MEMS based directional device, wherein the working fluid flowing from the expandable MEMS device towards at least one evaporator is in liquid phase; and utilizing the working fluid flowing from the expandable MEMS device towards at least one evaporator to facilitate heat transfer for at least one target device located between at least one evaporator and the condenser or between the expandable MEMS device and the evaporator.

Liquid cooling with parasitic phase-change pumps

The present invention includes a MEMS-based cooling system that can be passive or active in accordance with an embodiment of the present invention is disclosed. The MEMS-based cooling system has an expandable MEMS device that is a MEMS device that has one or more expandable chambers to help transfer heat autonomously from a heat source using a working fluid and one or more MEMS directional devices that can control the flow of the working fluid through one or more cooling channels that enable heat transfer from one or more heat sources to one or more heat sinks via the working fluid.

MEMS based device for phase-change autonomous transport of heat (PATH)

A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.

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Coralville, IA, United States of America

Qizhou Matthew Yao