Commscope Technologies LLC

Commscope Italy S.r.l.

Qiyun Gu

Sammit Patel

Yongjie Xu

Giuseppe Resnati

Xianxiang Li

Yangzhun Lv

Qing Mi

Michael Brobston

Richard W Brown

A band-stop filter comprises: a housing having a top wall, a bottom wall and at least one side wall, the housing defining an internal cavity; a signal input port and a signal output port that are respectively disposed on one of the at least one side wall; a resonating element that is disposed in the internal cavity and includes a top, a bottom, and a side; and a transmission line that is disposed in the internal cavity and coupled between the signal input port and the signal output port, the transmission line comprising a coupling section that is coupled to the resonating element, wherein the coupling section is configured to surround more than half of the side of the resonating element and not directly contact the housing and the resonating element.

Band-stop filter, transmission line for band-stop filter and multiplexer

Active antennas are provided that include a housing having a front surface, first and second side surfaces and a rear surface, where the front surface comprises a radome and the first and second side surfaces comprise respective first and second thermally-conducting frame members. These antennas further include at least one radio that is completely mounted within an interior of the housing. Each of the first and second thermally-conducting frame members includes a plurality of outwardly extending fins.

Base station antennas having fully embedded radios and housings with integrated heat sink structures

In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.

Vapor chamber amplifier module

In one embodiment, an apparatus includes three remote radio heads (RRHs) mounted on a pole using one or more triangular brackets, each RRH connected to a corresponding antenna. Each RRH includes an electronics module, a heat sink mounted on the electronics module, and a cover attached to the heat sink. The heat sink comprises a base, a plurality of attached forward-facing fins, and a pair of backward-facing fins. Each forward-facing fin and backward-facing fin comprises a proximal end attached to the base and an opposite distal end. The proximal ends of the plurality of forward-facing fins are collinear. The distal ends of the plurality of forward-facing fins and the backward-facing fins define an arc of an ellipse.

Growing community of inventors

Shanghai, China

Qiyun Gu