Shanghai Huali Microelectronics Corporation

Shanghai Huali Integrated Circuit Corporation

Shanghai Lilith Technology Corporation

Shanghai Huali Integrated Circuit Mfg. Co., Ltd.

Qiwei Wang

Haoyu Chen

Zhi Tian

Lei Zhang

Xiaochuan Wang

Tao Hu

Zhen Gu

Rong Zou

Jinshuang Zhang

Tao Liu

Hua Shao

Zhigang Zhang

Juanjuan Li

Feng Ji

Qi Cheng

Chunhui Wu

Xiang Peng

Chengcheng Wang

Zhenxing Yang

Shaokang Yao

Haihua Zou

Yaoyu Zhan

The present application discloses an integrated structure of MOS transistors having different working voltages. A second spacer of a second MOS transistor having a middle second working voltage is formed by adding a third sub-spacer on the basis of a first spacer of a first MOS transistor having a relatively low first working voltage, and the first spacer is formed by stacking a first sub-spacer and a second sub-spacer. The thickness of the second spacer is adjusted via the third sub-spacer, so as to ensure that a GIDL leakage of the second MOS transistor under the second working voltage satisfies a requirement. The present application also discloses a method for manufacturing an integrated structure of MOS transistors having different working voltages.

Integrated structure of MOS transistors having different working voltages and method for manufacturing same

The present application provides a process method for improving reliability of a metal gate high-voltage device. Stacks layers formed over the gate oxide layer and spaced apart from each other. An SiCN layer is deposited to cover tops and sidewalls of the stack layers, and cover bottoms of slots between the stack layers. An HARP layer is deposited to covert the SiCN layer. The HARP layer over the stack layers and the slot regions is covered with a photoresist. Photolithography and etching are sequentially performed to open the HARP layer over the stack layers. The photoresist in the slot regions is reserved. The HARP layer over the stack layers outside the slot regions is removed. The operations are repeated for many times until the slot regions are filled with the HARP layer.

Process method for improving reliability of metal gate high-voltage device

The present application discloses a method for making an active area air gap, comprising: step 1, performing word line etching to form a plurality of word line structures on a semiconductor substrate, wherein each word line structure spans each field oxide and each active area; step 2, forming a protective spacer on a side surface of the word line structure in a self-aligned manner; step 3, etching the field oxide by means of isotropic etching, so as to lower the top surfaces of the field oxides within and outside a coverage area of the word line structure and thus form an active area air gap between the active areas, wherein the word line structure spans the active area air gap; and step 4, removing the protective spacer.

Method for making active area air gap

The present application provides a method for game object control in a game map, a mobile terminal and a computer readable storage medium. The method for game object control includes: constructing a game map; creating a random path in each map layer to connect the map units within each map layer; configuring an attribute threshold value for the each map layer, wherein an attribute threshold value of a subsequent map layer is greater than or equal to an attribute threshold value of a preceding map layer; controlling a game object to move along any map unit connected on the random path from the map starting point to the jump unit in any map layer, and granting the game object an attribute bonus with an attribute point when the game object falls into the any map unit; and freely adding the attribute bonus for the game object to improve an attribute, wherein a sum of the attribute point of the attribute bonus added is less than or equal to an attribute threshold value for a current map layer. With the above technical solution, the way the game object march within the game map can be enriched and the strategy can be increased.

Method for game object control in game map, mobile terminal, and computer readable storage medium

The present invention provides a semiconductor structure for a split gate flash memory cell and a method of manufacturing the same. The split gate flash memory cell provided by the present invention at least includes a select gate and a floating gate formed on the substrate, one side of the select gate is formed with an isolation wall, and the floating gate is on the other side of the isolation wall. An ion implantation region is formed in an upper portion of the substrate below the isolation wall, wherein the ion implantation type of the ion implantation region is different from the ion implantation type of the substrate. The manufactured split gate flash memory cell can reduce the influence of the channel inversion region on the channel current, thereby improving the characteristics of the channel current of the flash cell and optimizing the device performance.

Semiconductor structure of split gate flash memory cell

The present invention provides a semiconductor structure for forming a CMOS image sensor. The semiconductor structure includes at least a photodiode formed in the substrate for collecting photoelectrons, and the photodiode has a pinning layer, a first doped region and a second doped region in order from top to bottom in a height direction of the substrate. The semiconductor structure further includes a third doped region located in the substrate corresponding to a laterally extending region of the second doped region. The first doped region has an ion doping concentration greater than the ion doping concentration of the second doped region, the ion doping concentration of the second doped region is greater than the ion doping concentration of the third doped region, and the third doped region is in contact with the second doped region after diffusion. The present invention also provides a method of manufacturing the above-described semiconductor structure.

Semiconductor structure and the manufacturing method thereof

The present invention provides a manufacturing method for a semiconductor memory device. The method comprises: providing a substrate, wherein a gate structure of a memory transistor is formed on a memory area of the substrate, and a first layer used for forming a gate structure of a peripheral transistor is formed on a peripheral area of the substrate; performing lightly doped drain ion implantation on an upper part of a portion, on two sides of the gate structure of the memory transistor, of the memory area of the substrate by applying the first layer as a mask of the peripheral area; and etching the first layer to form the gate structure of the peripheral transistor. According to the present invention, an ion diffusion degree of source and drain electrodes of the memory area may be effectively increased, and the uniformity of a memory cell device is improved.

Manufacturing method for a semiconductor device

The present invention discloses a flash. A channel region comprises a first shallow trench formed in the surface area of a semiconductor substrate. A tunneling dielectric layer and a polysilicon floating gate are formed in the first shallow trench and extended to the outside of the first shallow trench. A control dielectric layer and a polysilicon control gate are sequentially formed on the two side surfaces in the width direction and the top surface of the polysilicon floating gate. A source region and a drain region are formed in a self-aligned manner in active regions on the two sides in the length direction of the polysilicon floating gate. The present invention further discloses a method for manufacturing a flash. The present invention can break through the limitation of the length of the channel on the size of the memory cell, thus reducing the area of the memory cell.

Flash with shallow trench in channel region and method for manufacturing the same

The present disclosure provides a non-volatile flash memory device and a manufacturing method thereof. The non-volatile flash memory device comprises at least a plurality of memory cells in a memory area. The manufacturing method comprises: providing a substrate, and defining the memory area of the non-volatile flash memory device on the substrate; forming a plurality of stack gates of the plurality of memory cells on a substrate corresponding to the memory area, and the top of each stack gate is a memory control gate of the memory cell; etching the memory control gates to reduce the height of the memory control gates with the fluid photoresist filled among the plurality of stack gates of the plurality of memory cells as a mask; and removing the fluid photoresist.

Non-volatile flash memory device and a manufacturing method thereof

The present invention provides a semiconductor structure for a split gate flash memory cell and a method of manufacturing the same. The split gate flash memory cell provided by the present invention at least includes a select gate and a floating gate formed on the substrate, one side of the select gate is formed with an isolation wall, and the floating gate is on the other side of the isolation wall. An ion implantation region is formed in an upper portion of the substrate below the isolation wall, wherein the ion implantation type of the ion implantation region is different from the ion implantation type of the substrate. The invention also provides a manufacturing method for manufacturing the above-mentioned split gate flash memory cell, and the manufacturing method provided by the invention can be compatible with the existing manufacturing process of the split gate flash memory cell without increasing the process cost and the process complexity. The manufactured split gate flash memory cell can reduce the influence of the channel inversion region on the channel current, thereby improving the characteristics of the channel current of the flash cell and optimizing the device performance.

Semiconductor structure of split gate flash memory cell and method for manufacturing the same

The invention discloses a global shutter CMOS image sensor. Each pixel unit of the global shutter CMOS image sensor includes a photo diode, a storage region and a first reset region, wherein the photo diode includes a first photosensitive doped region; a gate structure of a first transfer transistor is formed between the storage region and the first photosensitive doped region; a gate structure of a global shutter transistor is formed between the first reset region and the first photosensitive doped region; and inhomogeneous potentials are formed in the first photosensitive doped region through a doping structure. According to the invention, photo-induced carriers in the PDs of the pixel units, especially photo-induced carriers in the PDs of large pixel units, can be simultaneously and completely transferred to the storage region and the first reset region, and the overall performance of the device is improved.

Global shutter CMOS image sensor having photosensitive doped region with inhomogeneous potentials

The present disclosure provides a semiconductor device and a manufacturing method therefor. The manufacturing method for a semiconductor device is provided for forming through-holes in a semiconductor device, comprising: forming a plurality of shallow trench isolations in portions of a substrate corresponding to memory cell regions; forming a plurality of gates on surfaces of the portions of the substrate; forming spacers on side walls at both sides of the gates extending in the first direction; depositing a sacrificial layer on the memory cell region; removing portions of the sacrificial layer corresponding to the shallow trench isolations at memory cell drain, and depositing an isolation dielectric on the shallow trench isolations at the memory cell drain to form isolation strips; and removing the remaining sacrificial layer to form bottom through-holes in spaces formed after removing the remaining sacrificial layer.

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Shanghai, China

Qiwei Wang