Southeast University

Csmc Technologies Fab2 Co., Ltd.

Qinsong Qian

Longxing Shi

Weifeng Sun

Shengli Lu

Jing Zhu

Qi Liu

Siyang Liu

Shen Xu

Ziyan Zhou

Qiang Luo

Shengyou Xu

Hao Wang

Feng Lin

Wei Su

Leilei Shi

Weiwei Zhai

Yufan Wang

Yunwu Zhang

Song Ding

Kuo Yu

Xianguo Huang

Changlong Huo

A non-isolated resonant gate drive circuit includes a PMOS drive network, an NMOS clamping circuit and an inductor. The PMOS drive network and the NMOS clamping circuit are connected in parallel to two terminals of the inductor. Input signals of the PMOS drive network are provided by a function generator connected to a drive chip, drive signals are output via an output port vand an output port vafter the input signals are processed by the PMOS drive network, the NMOS clamping circuit and the inductor, the NMOS clamping circuit is used for controlling the state of the output port vand the output port vto change, and the inductor forms LC resonance together with a gate capacitor Cand a gate capacitor Cin the NMOS clamping circuit to recover energy in a process of turning off the drive circuit.

Non-isolated resonant gate drive circuit

An adaptive load optimization method for a resonant gate drive circuit is provided to optimize the switching loss, turn-on loss and gate drive loss under different MOSFET loads. A data table is pre-stored in a digital signal processor chip (DSP), and voltages and pre-charge times, corresponding to a low total loss, of the resonant gate driver obtained by actual tests in case of different load currents are recorded in the data table; and in actual application, after an analog-to-digital converter terminal (ADC) samples a load current, a load current, closest to the sampled load current, is read from the data table, and the digital signal processor chip (DSP) is enabled to perform table look-up to obtain an optimized voltage and pre-charge time of a gate drive circuit.

Adaptive load optimization method for resonant gate drive circuit

A control method for a four-switch buck-boost converter is provided. The control method adopts four-stage control, and divides the load range into two sections and adopts different control strategies according to a critical load value corresponding to optimal control. In Boost mode, before the critical load, Tand Tare kept constant, Tis a minimum value for realizing soft-switching, and Tdecreases with the increase of the load; when the critical load is reached, Tdrops to 0; and after the critical load, T, T, Tand T increase with the load. In Buck mode, before the critical load, Tand Tare kept constant, Tis a minimum value for realizing soft-switching, and Tdecreases with the increase of the load; when the critical load is reached, Tdrops to 0; and after the critical load, T, T, Tand T increase with the load.

Control method for four-switch buck-boost converter

A control system for synchronous rectifying transistor of LLC converter, the system comprising a voltage sampling circuit, a high-pass filtering circuit, a PI compensation and effective value detection circuit, and a control system taking a microcontroller (MCU) as a core. When the LLC converter is operating at a high frequency, a drain-source voltage Vof the synchronous rectifying transistor delivers, via the sampling circuit, a change signal of the drain-source voltage during turn-off into the high-pass filtering circuit and the PI compensation and effective value detection circuit to obtain an effective value amplification signal of a drain-source voltage oscillation signal caused by parasitic parameters, and the current value is compared with a previously collected value via a control circuit taking a microcontroller (MCU) as a core, so as to change a turning-on time of the synchronous rectifying transistor in the next period.

Control system for synchronous rectifying transistor of LLC converter

The invention discloses a self-adaptive synchronous rectification control system and a self-adaptive synchronous rectification control method of an active clamp flyback converter. The control system comprises a sampling and signal processing circuit, a control circuit with a microcontroller as a core and a gate driver. According to the control method, a switching-on state, an early switching-off state, a late switching-off state and an exact switching-off state of a secondary synchronous rectifier of the active clamp flyback converter can be directly detected, and the synchronous rectifier and a switching-on time of the synchronous rectifier in next cycle can be controlled according to a detection result. After several cycles of self-adaptive control, the synchronous rectifier enters the exact switching-on state, thus avoiding oscillation of an output waveform of the active clamp flyback converter.

Self-adaptive synchronous rectification control system and method of active clamp flyback converter

Parasitic high-voltage diodes implemented by integration technology in a high-voltage level shift circuit are used for charging a bootstrap capacitor C, wherein a power supply end of the high voltage level shift circuit is a high-side floating power supply VB, and a reference ground is a floating voltage PGD that is controlled by a bootstrap control circuit. A first parasitic diode Dand a second parasitic diode Dare provided between the VB and the PGD. The bootstrap control circuit is controlled by a high-side signal and a low-side signal.

Integrated bootstrap high-voltage driver chip and technological structure thereof

A transverse ultra-thin insulated gate bipolar transistor having current density includes: a P substrate, where the P substrate is provided with a buried oxide layer thereon, the buried oxide layer is provided with an N epitaxial layer thereon, the N epitaxial layer is provided with an N well region and P base region therein, the P base region is provided with a first P contact region and an N source region therein, the N well region is provided with an N buffer region therein, the N well region is provided with a field oxide layer thereon, the N buffer region is provided with a P drain region therein, the N epitaxial layer is provided therein with a P base region array including a P annular base region, the P base region array is located between the N well region and the P base region, the P annular base region is provided with a second P contact region and an N annular source region therein, and the second P contact region is located in the N annular source region. The present invention greatly increases current density of a transverse ultra-thin insulated gate bipolar transistor, thus significantly improving the performance of an intelligent power module.

Transverse ultra-thin insulated gate bipolar transistor having high current density

A high-current, N-type silicon-on-insulator lateral insulated-gate bipolar transistor, including: a P-type substrate, a buried-oxide layer disposed on the P-type substrate, an N-type epitaxial layer disposed on the oxide layer, and an N-type buffer trap region. A P-type body region and an N-type central buffer trap region are disposed inside the N-type epitaxial layer; a P-type drain region is disposed in the buffer trap region; N-type source regions and a P-type body contact region are disposed in the P-type body region; an N-type base region and a P-type emitter region are disposed in the buffer trap region; gate and field oxide layers are disposed on the N-type epitaxial layer; polycrystalline silicon gates are disposed on the gate oxide layers; and a passivation layer and metal layers are disposed on the surface of the symmetrical transistor. P-type emitter region output and current density are improved without increasing the area of the transistor.

High-current N-type silicon-on-insulator lateral insulated-gate bipolar transistor

An isolation structure of a high-voltage driving circuit includes a P-type substrate and a P-type epitaxial layer; a high voltage area, a low voltage area and a high and low voltage junction terminal area are arranged on the P-type epitaxial layer; a first P-type junction isolation area is arranged between the high and low voltage junction terminal area and the low voltage area, and a high-voltage insulated gate field effect tube is arranged between the high voltage area and the low voltage area; two sides of the high-voltage insulated gate field effect tube and an isolation structure between the high-voltage insulated gate field effect tube and a high side area are formed as a second P-type junction isolation area.

Isolation structure of high-voltage driving circuit

A silicon on insulator N type semiconductor device, includes a N type drift region, a P type deep well, an N type buffer well, a P type drain region, an N type source region and a P type body contact region; a field oxide layer and a gate oxide layer arranged on a silicon surface, and a polysilicon lattice arranged on the gate oxide layer; and an N type triode drift region, a P type deep well, an N type triode buffer well, a P type emitting region, an N type base region, an N type source region and a P type body contact region; a field oxide layer and a gate oxide layer arranged on a silicon surface, and a polysilicon lattice arranged on the gate oxide layer.

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Jiangsu, China

Qinsong Qian