Intel Corporation

Jds Uniphase Corporation

Qinrong Yu

Qing Tan

Zhihua Li

Michael Ayliffe

Zhongjian Wang

Niki Liu

Rongtang Fan

Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate. In still another embodiment, a stepped heat spreader, having a base portion and a pedestal portion, has the pedestal portion inserted through the microelectronic substrate, wherein the photonic device is in thermal contact with the pedestal portion proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the base portion.

Heat removal from photonic devices

The invention relates to an electro-static variable optical attenuator suitable for use in a small form factor pluggable module. A short cladding suppressing fiber, such as a double clad optical fiber, dissipates attenuated light coupled to the cladding to reduce modal interference in the output light, while also reducing PDL and WDL introduced by the off set attenuation mechanism.

Small form factor variable optical attenuator with cladding mode suppressing fiber

Growing community of inventors

San Jose, CA, United States of America

Qinrong Yu