Nexperia B.v.

Qingyuan Tang

JinXin Yi

Jennifer Schuett

Frank Burmeister

YuJun Zhao

Yuan Li

Dicky Tirta Djaja

A substrate-based package semiconductor device is provided. The present disclosure further relates to a carrier including a plurality of non-singulated substrate-based package semiconductor devices and to a method of manufacturing the same. In embodiments in accordance with the present disclosure, the lowest insulating layer(s) has/have cavities arranged near and associated with one or more package terminals, and an inner wall of the cavities is covered with a conductive body that connects to the respective associated package terminal. Furthermore, the non-singulated substrate-based package semiconductor devices are separated by a separating region of the substrate, and the cavities are at least partially formed in the separating region.

Substrate-based package semiconductor device with side wettable flanks

An electronic package having a miniaturized footprint and a method for manufacturing the same is provided. Due to the arrangement of bottom contacts of the electronic package using a first partial vias, a footprint is obtained that is miniaturized with respect to the known electronic package comprising a same-sized electronic component. The electronic package according to the present disclosure enables packaging multiple electronic components while nevertheless minimally increasing the footprint with respect to conventional electronic packages.

Electronic package and method for manufacturing the same

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Nijmegen, Netherlands

Qingyuan Tang