Agency for Science, Technology and Research

Institute of Microelectronics

Knowles Electronics, Inc.

Qingxin Zhang

Zhe Wang

Hanhua Feng

Dim-Lee Kwong

Guo-Qiang Patrick Lo

Pang Dow Foo

Mingbin Yu

Yu Du

Chee Wei Tan

A microelectromechanical system (MEMS) device, method of operating the MEMS device, and a method of forming the MEMS device are provided. The MEMS device includes a positioning mechanism and a locking mechanism. The positioning mechanism includes a first arm structure having a first surface and a second surface; a second arm structure having a first surface and a second surface; wherein the first surface of the first arm structure faces the first surface of the second arm structure. The positioning mechanism also includes a first actuator disposed adjacent to the second surface of the first arm structure facing away from the second arm structure; and a second actuator disposed adjacent to the second surface of the second arm structure facing away from the first arm structure. The locking mechanism includes a first pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the first arm structure between the first and second surfaces of the first arm structure; and a second pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the second arm structure between the first and second surfaces of the second arm structure. The first and second pairs of locking elements are configured to engage with and disengage from the first and second arm structures respectively.

Microelectromechanical system (MEMS) device, method of operating the same, and method of forming the same

The wafer arrangement () provided comprises a first wafer (), which comprises an integrated circuit and a recess (). The wafer arrangement further comprises a portion of a second wafer (), which comprises a carrier portion and a protrusion (), the protrusion comprising an active component or actively controlled component () such as a MEMS component, wherein the portion of the second wafer () is coupled to the first wafer () such that the protrusion () is received in the recess (). The invention provides a mechanism for accurately aligning an active component () on the second wafer () with components on the first wafer (), such as photonic, electronic or optical components.

Wafer arrangement and a method for manufacturing the wafer arrangement

A silicon condenser microphone is described. The silicon condenser microphone of the present invention comprises a perforated backplate comprising a portion of a single crystal silicon substrate, a support structure formed on the single crystal silicon substrate, and a floating silicon diaphragm supported at its edge by the support structure and lying parallel to the perforated backplate and separated from the perforated backplate by an air gap.

High performance silicon condenser microphone with perforated single crystal silicon backplate

When using hot alkaline etchants such as KOH, the wafer front side, where various devices and/or circuits are located, must be isolated from any contact with the etchant. This has been achieved by using two chambers that are separated from each other by the wafer that is to be etched. Etching solution in one chamber is in contact with the wafer's back surface while deionized water in the other chamber contacts the front surface. The relative liquid pressures in the chambers is arranged to be slightly higher in the chamber of the front surface so that leakage of etchant through a pin hole from back surface to front surface does not occur. As a further precaution, a monitor to detect the etchant is located in the DI water so that, if need be, etching can be terminated before irreparable damage is done.

Apparatus and process for bulk wet etch with leakage protection

Growing community of inventors

Singapore, Singapore

Qingxin Zhang