Tyco Electronics (shanghai) Co., Ltd.

Shenzhen Ami Technology Co., Ltd

Te Connectivity Corporation

Measurement Specialties (chengdu) Ltd.

Te Connectivity Services Gmbh

Tyco Electronics (dongguan) Co. Ltd

Etern Biopharma (shanghai) Co., Ltd.

Tyco Electronics Corporation

Te Connectivity Germany Gmbh

Tyco Electronics (shenzhen) Co. Ltd.

Measurement Specialties (china) Ltd.

Te Connectivity Solutions Gmbh

Measurement Specialties, Incorporated

Meas France

Kunshan League Automechanism Co.. Ltd.

Qinglong Zeng

Dandan Zhang

Lvhai Hu

Yun Liu

Yingcong Deng

Roberto Francisco-Yi Lu

Lan Gong

Qian Ying

Zhiyong Dai

Fengchun Xie

Yong Yan

Lei Zhou

Wei Kang

Charles David Fry

Bicheng Chen

Yu Zhang

Jing Li

Songping Chen

Ming Xu

Lin Ye

George J Dubniczki

Qiangang Zheng

Hongzhou Shen

Hao Zhuge

Xiangyou Hou

Yang Zhou

Zhi Bin Li

Yaodong Wu

Changjun Wang

Sebastian Wiechert

Zhao Li

Jin Su

Hamza Boumeddane

Roberto-Francisco Yi Lu

Karlheinz Glaser

Yanbing Fu

Zhenliang Chen

Wenzhao Liao

Nicolas Christophe R Pecquet

Qiyu Cai

Jeffrey Rochette

Yumin Lan

Haidong Wu

Eric Broch

Fengchu Xie

Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2.

Spiro aromatic ring compound and application thereof

A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

Wire fixation apparatus and soldering method

A positioning device that has a support table, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically at the top of each sliding block, a base on which the support table is supported, a cylinder in the base, a ball in the cylinder, a piston rod slidably mounted in the cylinder and pushing the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the piston rod to move downward in the vertical direction to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the second horizontal direction, so that the positioning plates drive the electronic device in the positioning slot to move toward a center of the opening.

Positioning device

A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

Laser soldering system

An automatic pick-up equipment adapted to pick up components having different shapes includes a base mounted on a manipulator of a robot, a first pick-up device mounted on the base and including a pair of first gripping mechanisms opposite to each other, and a second pick-up device mounted on the base and including a pair of second gripping mechanisms opposite to each other and a rotation mechanism. The first gripping mechanisms are configured to linearly reciprocate relative to each other to grip a first component. The second gripping mechanisms are configured to pivotally reciprocate relative to each other to grip a second component. The rotation mechanism is configured to drive the second gripping mechanisms to rotate relative to the base to change a posture of the second component.

Automatic pick-up equipment

A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.

Fixing apparatus

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

Wire automatic soldering system

A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

Carrier

A fixing device adapted to fix at least one needle-shaped member comprises a fixing base and a fixing mechanism. The fixing base has at least one positioning groove disposed at a front end of the fixing base. The needle-shaped member is adapted to be positioned in the positioning groove. The fixing mechanism has at least one pressing protrusion at a front end of the fixing mechanism. The pressing protrusion is adapted to press and hold the needle-shaped member in the positioning groove.

Fixing device

An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.

Automatic solder paste feeding system

A gripping system includes a gripping device and a pitch adjustment device. The gripping device has a row of grippers arranged in a first direction and adapted to grip a row of contacts and a support frame on which at least two adjacent grippers of the row of grippers are slidably attached. The pitch adjustment device is adapted to drive the at least two adjacent grippers to slide in the first direction to adjust a pitch between the two adjacent grippers.

Gripping system

A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism.

A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.

Wire processing apparatus

Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2. 

An automatic fiber stripping system comprises a first stripping module, a second stripping module, and a heating device. The first stripping module and the second stripping module each have a stripping belt, a driven belt wheel, a driving belt wheel, and a stripping tool including a pressing portion. The stripping belts are tightened on the pressing portions and the stripping tools press the stripping belts on each of two opposite sides of an optical cable. A blade portion of one of the stripping tools cuts a notch in at least one of two side edges of an outer coating layer of the optical cable. The heating device heats and softens the outer coating layer of the optical cable. The stripping belts are driven to move relative to the optical cable by the driving belt wheels so as to strip off a segment of the outer coating layer from the notch.

Automatic fiber stripping system and method

Growing community of inventors

Shenzhen, China

Qinglong Zeng