Teledyne Scientific and Imaging, LLC

The Boeing Company

Qingjun Cai

Chung-Lung Chen

Avijit Bhunia

Julie Fatemeh Asfia

Chialun Tsai

Olivier H Sudre

A system for thermal management and structural containment includes an enclosure, a heat source disposed within the enclosure; and a wick encompassing at least a portion of an outer surface of the heat source.

Multi-functional high temperature structure for thermal management and prevention of explosion propagation

A cooling system that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face.

System for using active and passive cooling for high power thermal management

In one aspect of the present invention, a multi-layer wick for a loop heat pipe is provided. The multi-layer wick includes a primary wick, the primary wick comprising: a first layer; and a second layer, wherein the first layer surrounds the second layer; and a secondary wick, wherein the second layer of the primary wick surrounds the secondary wick. In another aspect of the present invention, a method of fabricating a multi-layer wick is provided. The method includes machining the outer diameter of an inner layer larger than the inner diameter of an outer layer; heating the outer layer to enlarge the inner diameter; inserting the inner layer into the outer layer; and cooling the inner layer and the outer layer.

Multi-layer wick in loop heat pipe

A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.

Heat spreader with high heat flux and high thermal conductivity

A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.

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Thousand Oaks, CA, United States of America

Qingjun Cai