Shenzhen China Star Optoelectronics Technology Co., Ltd.

Qingdou Yang

Yawei Liu

The present invention discloses a method for packaging an organic light emitting diode: allocating a position for attaching a glass cloth tape on the packaging substrate; attaching the glass cloth tape on the position; bonding an organic light emitting diode substrate to the packaging substrate; melting the glass cloth tape, so that the organic light emitting diode substrate welds together with the packaging substrate. The present invention can avoid the presence of a welding gap, so that external gas cannot enter into an internal part of the packaging body, thereby increasing the service life of the OLED device.

Method for packaging an organic light emitting diode and a display device using the same

A sealant curing system and a method of curing a sealant using the same are disclosed. The sealant curing system includes a curing room and a UV light outputting panel. The curing room is used for receiving a display panel having the sealant which is ready to be cured. The UV light outputting panel is used for displaying a sealant curing image according to a preset displaying data, and is used for producing a UV light. The UV light is used for irradiating and curing the sealant of the display panel. The present invention is capable of eliminating a process in which different masks are replaced for display panels of different sizes.

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Shenzhen, China

Qingdou Yang