Delta Electronics (shanghai) Co., Ltd

Delta Electronics, Inc.

Qingdong Chen

Shouyu Hong

Pengkai Ji

Yiqing Ye

Jinping Zhou

Ganyu Zhou

Xiaoni Xin

Min Zhou

Jianhong Zeng

Zhenqing Zhao

Zhiheng Fu

Mingzhun Zhang

Kai Lu

Yan Tong

Yan Chen

Le Liang

Xin Zou

Jiaoping Huang

Tao Wang

Haoyi Ye

Weicheng Zhou

Haibin Xu

Yu Zhang

Chongfeng Zheng

Wulong Cong

Sansan Guo

Ningning Zhang

A multi-winding inductor includes a magnetic core including four magnetic columns and a winding assembly including two windings. Each winding includes three portions. The first and third portions of the first winding are respectively between the first and the second magnetic columns, and the third and the fourth magnetic columns; and the first and third portions of the second winding are respectively between the fourth and the first magnetic columns, and the second and the third magnetic columns. Both the first portions of two windings extend to a surface of the magnetic core and respectively form a first and a third pins. The winding is a flat wire with the thickness less than the width, and the width direction is parallel to an extension direction of the first magnetic column.

Multi-winding inductor and power supply module

A power module includes a substrate, at least one power unit, a first carrier plate and at least one input capacitor. The power unit is disposed on the substrate and includes at least one half-bridge circuit including a first power switch and a second power switch connected in series. A second terminal of the first power switch and a first terminal of the second power switch are connected to a node. The first carrier plate and the input capacitor are arranged between the power unit and the substrate. A first electrode of the substrate is connected with the node through the first carrier plate. A top surface of a first terminal of the input capacitor is connected with a first terminal of the first power switch, and a top surface of a second terminal of the input capacitor is connected with a second terminal of the second power switch.

Power module

The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a metal wiring layer on an outer side of the insulation layer through a metallization process; and dividing at least part of the metal wiring layer into a multi-turn metal winding through a mechanically dividing process.

Manufacturing method of magnetic element

A magnetic element includes a magnetic core assembly and a winding assembly. The magnetic core assembly includes a first magnetic part. The winding assembly includes a first winding. The first winding is wound around the first magnetic part. Moreover, at least a portion of a substrate is formed as the first winding. The substrate includes a first accommodation space and a first metal structure. Moreover, at least a portion of the first metal structure is formed as at least a portion of the first winding and disposed on four lateral surfaces of the first accommodation space, and at least a portion of the first magnetic part is disposed within the first accommodation space.

Magnetic element and manufacturing method thereof

The present disclosure provides a magnetic element, a manufacturing method of a magnetic element, and a power module. The magnetic element includes: a magnetic core; and a metal wiring layer, where the metal wiring layer is flat wound on a surface of at least one section of a magnetic column of the magnetic core, the metal wiring layer includes a vertical portion and a horizontal portion, and at least part of the vertical portion forms a multi-turn metal winding by mechanically dividing.

Magnetic element, manufacturing method of magnetic element, and power module

A multi-winding inductor includes a magnetic core including three magnetic columns and two windings. Each winding includes a first, a second and a third portions. The first magnetic column is arranged between the first portion of the first winding and the first portion of the second winding; the second magnetic column is arranged on one side of the first portion of the first winding and the third portion of the second winding; and the third magnetic column is arranged between the third portion of the first winding and the third portion of the second winding. The first and the second portions of two windings respectively form pins on opposite sides of the magnetic core.

A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.

Substrate, manufacturing method, and power module with same

The present disclosure provides a power supply system and an electronic device. The power supply system is used to supply power to a load and includes a system board where the load is disposed; a substrate; at least one output capacitor surface-mounted on the second side of the system board; at least one positive output conductive-connected region disposed on the first side of the substrate, and being electrically connected to one terminal of the at least one output capacitor; at least one negative output conductive-connected region disposed on the first side of the substrate, and being electrically connected to other terminal of the at least one output capacitor; and at least one power unit disposed on the second side of the substrate, and being electrically connected to the at least one positive output conductive-connected region and the at least one negative output conductive-connected region.

Power supply system and electronic device

A power module and a manufacturing method thereof are disclosed. The power module includes a substrate, a power device, a leading component and a molding component. The substrate includes a first side, a second side and a conductive wire. The power device is disposed on the substrate and electrically connected with the conductive wire. The leading component is disposed on the substrate and includes a first horizontal portion and a vertical portion connected with each other. The vertical portion is electrically connected with the conductive wire. The leading component includes a first contact surface and a second contact surface, which are non-coplanar. The molding component is disposed on the substrate and covers at least portion of the substrate and at least portion of the leading component. The first contact surface and the second contact surface are uncovered by the molding component.

Manufacturing method of power module

The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.

Power module, chip-embedded package module and manufacturing method of chip-embedded package module

A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.

Carrier board and power module using same

A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

Power module and manufacturing method thereof

A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.

System of providing power

The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

Connector, method for manufacturing connector and signal pin assembly

A multi-chip package power module according to the present disclosure, comprising: multiple chips, including a first chip and a second chip that are arranged adjacently; a first conductive member, at least partially arranged between the first chip and the second chip, and a second conductive member, at least partially arranged between the first chip and the second chip, where the first conductive member is electrically connected to a power pin of the first chip, the second conductive member is electrically connected to a power pin of the second chip, and the multiple chips, the first conductive member and the second conductive member are all embedded in an insulating package material. For the multi-chip package power module according to the present disclosure, the power output current of the chip can be directly led out from two opposite sides through the conductive member to obtain a symmetrical path.

Growing community of inventors

Shanghai, China

Qingdong Chen