Asm Technology Singapore Pte Ltd

Qing Le Tan

Keng Yew Song

Yi Bin Wang

Gang Shu

Chin Tiong Ong

Jia Le Luo

Zuo Cheng Shen

Soo Kin (Kenny) Tan

Lin Wei Zheng

A foreign particle removal system for removing a foreign particle from a surface of an object has a tool gripper which grips a particle removal tool. A tip of the particle removal tool has a sticky tip portion. The sticky tip portion has an apex region at a remote end of the sticky tip portion and a flank region adjoining the apex region. The tool gripper holds the particle removal tool at an oblique angle with respect to the surface so that the flank region of the sticky tip portion faces towards the surface. The tilted particle removal tool is conveyed with the tool gripper to contact the foreign particle on the surface with the flank region of the sticky tip portion and a force is exerted onto the surface to attract the foreign particle onto the flank region. The particle removal tool may then be lifted away from the surface together with the foreign particle.

Automated particle removal system having angular adjustability

A foreign particle removal system for removing a particle from a surface of a fragile object has a tool gripper which grips a particle removal tool. A force sensing device determines a cleaning position of the particle removal tool relative to the surface whereat a threshold force is exerted on the surface, the threshold force being a force that is exerted by the particle removal tool on the surface that would pick up the foreign particle but would not damage the object. The particle removal tool is conveyed over a location of the foreign particle and is moved towards the surface to the cleaning position whereat the threshold force is exerted on the surface. The particle removal tool is then lifted away from the surface together with the foreign particle.

Automated particle removal system

Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.

Method and apparatus for measuring a free air ball size during wire bonding

A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.

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Singapore, Singapore

Qing Le Tan