Boe Technology Group Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Other

Dalian University of Technology

Beijing Naura Microelectronics Equipment Co., Ltd.

State Grid Corporation of China

Economic & Technology Research Institute of Hubei Electric Power Company

Central China Grid Company Limited

Qing Chang

Wei He

Wei Shan Dong

Yang Zhao

Jian Yang

Sheng Zhu

Xinghua Li

Xiaoming Wang

Jing Shi

Wenyu Wang

Guofeng Han

Zhiqiang Ren

Tao Teng

Yao Meng

Lixia Huang

Zhaofeng Bai

Yanyang Wang

Yang Han

Guobin Li

Zhiyong Qin

Fumin Xu

Yu Sun

Bing Li

Wenbin Yang

Wenqiang Chen

Shi Cheng

Jiao Fang

Wei Dong

Yanxia Xin

Mengxin Zhao

Xiangnan Wang

Yuedong Shang

Dongyang Wang

Guodong Bian

Jingyou Xu

Jinhao Huang

Hanping Xu

Jisheng Li

Shou Ye

Chunming Wang

Youping Xu

Dawei Huang

Xiuwen Xiong

Zhanwu Peng

A shield cooling assembly includes an adapter configured to fix a shield in the chamber. The adapter includes a first surface and a second surface facing an outer side surface of the shield and a bottom surface of a bottom wall of the shield, respectively. A predetermined gap is provided between the first surface and the outer side surface of the shield. The second surface is in contact with the bottom surface of the bottom wall of the shield. The adapter is provided with a cooling channel for transmitting a cooling medium to cool the shield.

Shield cooling assembly, reaction chamber and semiconductor processing apparatus

The present disclosure provides a carrying device and a semiconductor processing apparatus. The carrying device includes a heating plate and a cooling plate, the heating plate and the cooling plate are spaced apart, and a thermal insulation region is formed between the heating plate and the cooling plate. The carrying device of the present disclosure not only can preempt the need to stop the process due to excessively high temperature, but also can maintain a uniform and stable temperature throughout the process, thereby providing a qualified and stable processing temperature for a workpiece to be processed, and eventually obtaining better processing results.

Carrying device and semiconductor processing apparatus

An apparatus for efficiently preparing spherical metal powder for 3D printing includes a housing, a crucible and a powder collection area arranged in the housing, wherein a turnplate arranged in the collection area is an inlaid structure. A material having a poor thermal conductivity is selected as the base of the turnplate, and a metal material having a wetting angle less than 90&#xb0; with respect to droplets is selected and embedded into the base to serve as an atomization plane of the turnplate. An air hole is disposed in the turnplate. The spherical metal powder for 3D printing combines electromagnetic force breaking capillary jet flow and centrifugal atomization, which breaks through the traditional metal split mode, and makes the molten metal in a fibrous splitting.

Device and method for high-efficiency preparation of spherical metal powder for 3D printing employing separation into fibers

The present disclosure provides a light valve, a display device and a display method. The light valve includes: at least one fixation member fixed onto a substrate; and at least one movable member capable of moving relative to the fixation member to switch the light valve between a first state where the light valve is provided with a slit through which a light beam passes and a second state where the light valve prevents the light beam from passing therethrough.

Light valve, display device and display method

An apparatus includes a housing, a crucible disposed in the housing, and a collection bin. A turnplate disposed in a powder collection area is of an inlaid structure. A concentric circular groove is provided on the atomization plane. An air hole is provided in the turnplate. The present invention combines the pulsated orifice ejection method and the centrifugal atomization method, in cooperation with the turnplate structure and subjecting the turnplate surface to induction heating, so that a metal liquid is allowed to break through the split mode of traditional molten metal, achieves a fibrous split mode that can be implemented only when an atomizing medium is an aqueous or organic solution, and prepares a high-melting-point metal powder that meets requirements, and has a controllable particle size, high sphericity, no satellite droplets, and good flowability and spreadability, and is suitable for industrial production.

Apparatus and method for preparing spherical metal powder based on one-by-one atomization method for uniform droplets

An apparatus efficiently preparing ultrafine spherical metal powder includes a housing, a crucible and a powder collection area arranged in the housing. The turnplate arranged in the powder collection area is an inlaid structure. The part inlaid into the body part acts as an atomization plane of the turnplate. The atomization plane is provided with a concentric circular groove, and the turnplate is provided with an air hole. The apparatus is used for preparing ultrafine spherical metal powder by on-by-one droplets centrifugal atomization method, mainly combining the uniform droplet jet method and the centrifugal atomization method, which breaks through the traditional metal splitting model, makes the molten metal in a fibrous splitting, so as to efficiently prepare ultrafine spherical metal powder with narrow particle size distribution interval, high sphericity, good flowability, excellent spreadability, uniform and controllable size, no satellite droplets and suitable for industrial production.

Apparatus and method for efficiently preparing ultrafine spherical metal powder by one-by-one droplets centrifugal atomization method

The present disclosure provides a pixel unit including a plurality of sub-pixels of different colors. Each sub-pixel includes a first transflective layer, a wavelength selective cavity, and a second transflective layer disposed successively along an incident light direction. A height of the wavelength selective cavity of each sub-pixel in the incident light direction is designed so as to select light having a wavelength corresponding to a color of the sub-pixel from light which is incident through the first transflective layer and reflected between the first transflective layer and the second transflective layer, and selected light exits through the second transflective layer. The present disclosure further provides a display substrate and a display panel.

Pixel unit, display substrate and display panel

A display panel includes an array substrate, and a plurality of display units disposed on the array substrate each of which includes a display sub-pixel for receiving sunlight radiation and performing display, a solar cell disposed adjacent to the display sub-pixel and configured to receive sunlight radiation and perform photoelectric transformation, a micro-electromechanical optical valve disposed above and movable over the display sub-pixel and the solar cell to control a light transmittance of the display sub-pixel, and a blocking structure disposed at an edge of the display unit to limit the movement of the micro-electromechanical optical valve within the display unit.

Display panel, controlling method thereof and window comprising the same

The invention relates to a parallelization method for black-start subsystems of a power grid with external support, which includes, after power blackout, partitioning the power grid into subsystems, and respectively performing black-start on the subsystems based on a power grid black-start research scheme, performing stability check on each subsystem, performing voltage calculation on parallel lines between the subsystems, checking the parallelizing simulation of the subsystems, and determining a feasible parallelizing path and a recommendable charging direction. The method further includes, starting from the subsystems having external support and higher stability, networking them with an external power grid, parallelizing the networked subsystems having external support to obtain a subnet of the subsystems, parallelizing subsystems having no external support with the subnet of the subsystems to obtain a regional subnet, and finally parallelizing the remaining subsystems with the regional subnet to implement parallelization of black-start subsystems of the whole power grid.

Parallelization method for black-start subsystems of power grid with external support

An array substrate, a manufacturing method thereof, and a display device, the array substrate comprises: a base substrate; a plurality of light emitting units disposed on the base substrate to constitute a light emitting region, a display region driving circuit electrically connected to the plurality of light emitting units; and a peripheral circuit disposed at a periphery of the display region driving circuit, at least one light emitting unit is located on the peripheral circuit, and an orthographic projection of the at least one light emitting unit on the base substrate and an orthographic projection of the peripheral circuit on the base substrate have an overlapping portion there-between. The array substrate can realize a narrow frame design.

Array substrate for narrow frame design, manufacturing method thereof and display device

An organic light-emitting diode substrate is provided. The organic light-emitting diode substrate comprises a substrate; a conductive layer formed over the substrate comprising a plurality of anodes and a plurality of cathodes, wherein each of the anodes are electrically insulated from the rest of the anodes and the cathodes; and a light-emitting layer formed over the plurality of anodes and the plurality of cathodes and being electrically connected with the plurality of anodes and the plurality of cathodes.

Top-emitting OLED substrate and fabrication method thereof, and display apparatus

Growing community of inventors

Beijing, China

Qing Chang