Avago Technologies General IP (Singapore) Pte. Ltd.

Avago Technologies Wireless IP (Singapore) Pte. Ltd.

Agilent Technologies, Inc.

Qing Bai

Tracy Verhoeven

John Dwight Larson, Iii

Ken A Nishimura

Hongfeng Yin

Frank Sigming Geefay

Farid Matta

David Dutton

Thor Miller Wilbanks

Ares Geovanos

A filter includes an inlet side, an outlet side, and a body. The body includes a first substrate that includes an array of inlet holes passing through the first substrate, and a second substrate that includes an array of outlet holes passing through the second substrate. The body further includes an intermediate region that includes a plurality of channels extending along a plane that is transverse or at an angle to a main axis of the filter. Each channel communicates directly or indirectly with at least one of the inlet holes and at least one of the outlet holes. The filter provides a plurality of fluid flow paths through the body from the inlet side to the outlet side.

Filters for liquid flow based devices and systems

A microfabricated device has a first substrate, a second substrate, a film bulk acoustic resonator (FBAR) device, and a circuit. The second substrate is bonded to the first substrate to define a chamber. The FBAR device is located on a surface of the first substrate and inside the chamber. The circuit is located on a surface of the second substrate and inside the chamber. An electrical connection connects the circuit and the FBAR device.

Film bulk acoustic resonator package and method of fabricating same

An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.

Attachment system incorporating a recess in a structure

A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a second material. The compliant element exhibits deformation consistent with the first substrate and a second side having been pressed together. In some embodiments, the second material is electrically conductive such that the compliant element provides a reliable electrical connection between the substrates. In other embodiments, the second material increases the hermeticity of the compliant element such that the compliant element provides a better hermetic seal between the substrates.

Device having a complaint element pressed between substrates

Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.

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Sunnyvale, CA, United States of America

Qing Bai