Everdisplay Optronics (Shanghai) Limited

Other

QiGuo Zhang

Chengpei Huang

Chuwan Huang

ChuWang Huang

Chungche Tsou

Yanpin Gao

The present disclosure is related to display panels, especially to flexible electronic devices. By means of adding an inorganic membrane with surface roughness between a bonding layer and a PI film, in order to effectively improve the dimensional stability of plastic substrate and the water/oxygen barrier property of flexible substrate during the PI film fabrication and the follow-up process, improving the yield of good products and prolonging the working life thereof.

Flexible electronic devices

The present disclosure provides a blue light organic light-emitting diode, which includes a first electrode layer; a first hole injection layer disposed on the first electrode layer; a second hole injection layer disposed on first hole injection layer; a hole transport layer disposed on the second hole injection layer; a blue light emitting material layer disposed on the hole transport layer; an electron transport layer disposed on the blue light emitting material layer; and a second electrode layer disposed on the electron transport layer, wherein the second hole injection layer has a thickness of 85 nm&#x2dc;105 nm. The present disclosure further provides a display including the device. The blue light organic light-emitting diode of the present disclosure can control blue light energy components having a wavelength less than 435 nm within 0.2%, which reduces the harm of the blue light in the wave band to human eyes to a great extent.

Blue light organic light-emitting diode and display including same

The present disclosure is related to a method of fabricating display panels, especially to a method of fabricating flexible electronic devices. By means of adding an inorganic membrane with surface roughness between a bonding layer and a PI film, in order to effectively improve the dimensional stability of plastic substrate and the water/oxygen barrier property of flexible substrate during the PI film fabrication and the follow-up process, improving the yield of good products and prolonging the working life thereof.

Method of fabricating flexible electronic devices

Provided herein is a flexible packaging substrate, comprising a first polymer layer; a metal foil layer disposed on the first polymer layer; a second polymer layer disposed on the metal foil layer; and wherein the surface area of the metal foil layer is larger than those of both the first and the second polymer layer. Also provided are a fabricating method for the same and a method for packaging an organic electroluminescent device using the same. The flexible packaging substrate according to the present invention is able to prevent oxygen and moisture from permeating effectively, allowing the service life of the packaged device prolonged. Additionally, the fabrication according to the examples of the present invention was performed through simple processes, and thereby the packaging process was simplified and the packaging performance was improved.

Growing community of inventors

Shanghai, China

QiGuo Zhang