Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

Ams-osram Asia Pacific Pte. Ltd.

Heptagon Photonics Pte. Ltd.

Qichuan Yu

Ji Wang

Simon Gubser

Hartmut Rudmann

Kam Wah Leong

Kian Siang Ng

Tobias Senn

James Eilertsen

Ming Jie Lee

Guo Xiong Wu

Bojan Tesanovic

Sonja Hanselmann

Han Nee Ng

Sundar Raman Gnana Sambandam

Xu Yi

John A Vidallon

Edmund Koon Tian Lua

Attilio Ferrari

Ramon Opeda, Jr

Martin Schubert

Hongyuan Liu

Cris Calsena

Jian Tang

Myo Paing

Eunice Ho Hui Ong

Joon Heng Tan

Nicola Spring

Robert Lenart

Sundar Raman Ghana Sambandam

Harmut Rudmann

Choon Hein Law

Yoong Kheng Teoh

Yeu Woon Chan

A method of manufacturing a master for use in a wafer-scale replication process is disclosed. The method comprises at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer. The method also comprises a step of developing the at least one patterned layer to provide one or more structures defining the master. In an embodiment, the at least one step of forming the layer of photoresist comprises a process of dry film lamination.

Method of manufacturing a master for a replication process

A method of manufacturing a plurality of optical elements (), the method comprising providing a first wafer () having hardened replication material forming optical elements () on a first side of the first wafer (), providing a second wafer () having hardened replication material forming optical elements () on a first side of the second wafer (), depositing liquid droplets () on the first side of the first wafer () between the optical elements () aligning the first side of the first wafer () with the first side of the second wafer (), and bringing the two wafers () together such that the liquid droplets () on the first side of the first wafer () adhere to the first side of the second wafer ().

Method of manufacturing a plurality of optical elements and product thereof

A method of making optical diffuser elements () includes providing a substrate () composed of a polymer material and having openings () therein. An optical diffuser material () is dispensed into the openings (), and the optical diffuser material () is hardened to form a sheet () composed of regions of the optical diffuser material () surrounded laterally by the polymer material. The method includes separating the sheet () into multiple optical diffuser elements () that retain their mechanical stability and optical properties when subjected to a reflow process.

Manufacture of optical diffusers composed of reflowable materials

Manufacturing optoelectronic modules includes supporting a printed circuit board substrate () on a first vacuum injection tool (). The printed circuit board substrate () has at least one optoelectronic component mounted thereon and has a solder mask () on a surface () facing away from the first vacuum injection tool (). The method includes causing the first vacuum injection tool () and a second vacuum injection tool () to be brought closer to one another such that a surface () of the second vacuum injection tool () is in contact with the solder mask (). Subsequently, a first epoxy () is provided, using a vacuum injection technique, in spaces () between the upper tool () and the solder mask ().

Vacuum injection molding for optoelectronic modules

The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (), wherein the replication tool () comprises a tool material comprising replication sites () comprising a replication surface () each. Each of the replication surfaces () corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features () for reducing asymmetric form errors of the device surfaces. Replication tools () and methods for manufacturing these are also described.

Replication and related methods and devices, in particular for minimizing asymmetric form errors

The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, an optoelectronic device mounted on a substrate can include an optical sub-assembly including a first optical element and a first micro-spacer on the optical element. The optical sub-assembly can be disposed over the optoelectronic device, with a first air or vacuum gap separating the first optical element from the optoelectronic device, and the first micro-spacer laterally surrounding the first air or vacuum gap.

Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same

The method for manufacturing a multitude of devices comprises: And it further comprises, after the conditioning: The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.

Method for conditioning a replication tool and related method for manufacturing a multitude of devices

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

Thin optoelectronic modules with apertures and their manufacture

The present disclosure describes light guides and a method of manufacturing light guides that include a rectangular prism-shaped bar, a first polymer or metal cladding on four sides of the rectangular prism-shaped bar, and a second polymer cladding disposed on the first polymer cladding on the four sides of the rectangular prism-shaped bar.

Light guides and manufacture of light guides

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub&#xac;structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

Optical element stack assemblies

This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.

Optical assemblies including a spacer adhering directly to a substrate

The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

Optical device

The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, micro-spacers can be applied on a first optical element layer, and a second optical element layer can be provided on the first micro-spacers. By providing the second optical element layer on the first micro-spacers, the second optical element layer and the first optical element layer can be separated from one another by air or vacuum gaps each of which is laterally surrounded by a portion of the first micro-spacers.

The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

Growing community of inventors

Singapore, Singapore

Qichuan Yu