Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Qichang An

Yue Li

Xue Cao

Yuelei Xiao

Yifan Wu

Yulin Feng

Biqi Li

Wenbo Chang

Huiying Li

Kidong Han

Lihui Wang

Feng Qu

Yi Zhou

Yanfei Ren

Qiuxu Wei

An electronic device is provided. The electronic device includes electric components in an effective area; and a retaining structure substantially surrounding a boundary of the effective area. The electronic device includes a base substrate, and multiple conductive layer and multiple insulating layers alternately stacked on the base substrate. The retaining structure is configured to enhance adhesion between conductive layers adjacent to each other in the electronic device. The retaining structure includes one or more retaining layers. A respective retaining layer of the one or more retaining layers is in direct contact with at least one insulating layer of the electronic device.

Electronic device and method of fabricating electronic device

A MEMS switch includes an insulating substrate, a driving electrode, a first insulating layer, a first surface of the insulating substrate is provided with a first region, the first region is closer to a surface of the insulating substrate away from the first surface, relative to the first surface, and the driving electrode is on the first region; the first insulating layer completely covers the driving electrode; the first signal transmission line is on a surface of the first insulating layer away from the insulating substrate; and the second signal transmission line includes a signal transmission segment and a cantilever segment connected together as a one-piece member, the signal transmission segment is on the first surface of the insulating substrate, and the cantilever segment is suspended on a side of the first signal transmission line away from the insulating substrate.

MEMS switch and method of manufacturing the same

A filter circuit includes a first resonant sub-circuit, a second resonant sub-circuit and an impedance matching network; the first resonant sub-circuit and the second resonant sub-circuit are each connected to the impedance matching network in series; the first resonant sub-circuit is configured to allow a signal with a frequency higher than a first frequency to pass; the second resonant sub-circuit is configured to allow a signal with a frequency lower than a second frequency to pass, and the second frequency is greater than the first frequency; the impedance matching network is configured to allow a signal between the first frequency and the second frequency to pass; the impedance matching network includes a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor and a first inductor.

Filter circuit, filter, method of manufacturing filter, and electronic device

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Beijing, China

Qichang An