Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

Qiaohong Huang

Tadashi Takano

Hong Jiang

Jie Bai

Yusuke Horiguchi

Younsang Kim

Youko Murata

Provided herein are compositions having a good balance between the curing speed, transparency, tackiness and/or melt viscosity thereof. In one aspect, there are provided compositions containing nano-particulate filler and the use thereof in the preparation of a variety of electronic components, e.g., three-dimensional integrated circuits. In certain aspects, there are provided three-dimensional integrated circuits prepared employing invention compositions (i.e., compositions containing nano-particulate filler), as well as methods for preparing such compositions, and the resulting three-dimensional integrated circuits. In certain aspects, there are also provided methods for improving the curing speed, transparency, tackiness and/or melt viscosity of pre-applied underfill compositions. In certain aspects, there are also provided pre-applied underfill compositions with improved processability.

Pre-applied underfill film containing nano-particulate filler for 3DIC applications, compositions useful for the preparation thereof, and uses thereof

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages

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Trabuco Canyon, CA, United States of America

Qiaohong Huang