Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Boe Mled Technology Co., Ltd.

Qiangwei Cui

Chao Liu

Linhui Gong

Ke Meng

Lili Wang

Chuhang Wang

Haiwei Sun

Yutian Chu

Fan Yang

Feng Qu

Jing Liu

Donghui Wang

Zhaohui Li

Zhenxing Tang

An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region; a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, in the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.

Array substrate and preparation method therefor, and display panel and display device

A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.

Micro-LED transfer method and display panel

Disclosed are a pattern transfer apparatus and a pattern transfer method. The pattern transfer method includes: transferring a pattern to a flexible printing substrate; and transferring the pattern on the printing substrate to a bending surface of a rigid carrier through an elastic rubber head.

Pattern transfer apparatus and pattern transfer method

The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.

Display panel and method for manufacturing same, bonding method, and display device

A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.

Driving substrate and manufacturing method thereof, and display device

A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

Chip bonding method and bonding device

Growing community of inventors

Beijing, China

Qiangwei Cui