Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Qiang Zou

Dariusz Burak

Richard C Ruby

John Choy

Donald Lee

Chris Feng

Tina L Lamers

Kevin J Grannen

Phil Nikkel

Martha K Small

Kristina Lamers

Wei Pang

Zhiqiang Bi

Alexandre Shirakawa

David A Feld

Andrew Thomas Barfknecht

Jing Wu

Frank Bi

Tangshiun Yeh

Mohamed Abd Allah

Zongliang Cao

Guiti Zolfagharkhani

Siamak Fouladi Azarnaminy

Sook Ching Chang

An acoustic resonator includes a first electrode disposed over a substrate; a piezoelectric layer disposed over the first electrode; a second electrode disposed over the piezoelectric layer; and a ring disposed in either the first electrode, or in the second electrode. The ring defines at least a portion of a perimeter along an active region of the acoustic resonator.

Bulk acoustic wave resonator comprising a ring

An acoustic resonator device includes a composite first electrode disposed over a substrate; a piezoelectric layer disposed on the composite first electrode, the piezoelectric layer including a piezoelectric material doped with scandium for improving piezoelectric properties; and a second electrode disposed on the piezoelectric layer. The composite first electrode includes a base electrode layer disposed over the substrate; a temperature compensation layer disposed on the base electrode layer; a seed interlayer disposed on the temperature compensation layer, the seed interlayer having a thickness between about 5&#x212b; and about 150&#x212b;; and a conductive interposer layer disposed on at least the seed interlayer, at least a portion of the conductive interposer layer contacting the base electrode layer. The piezoelectric layer has a negative temperature coefficient and the temperature compensation layer has a positive temperature coefficient at least partially offsetting the negative temperature coefficient.

Temperature compensated acoustic resonator device having thin seed interlayer

A BAW resonator includes a nonlinear substrate defining a cavity, and an acoustic stack over the cavity, including a bottom electrode, a piezoelectric layer, and a top electrode, where an active region of the acoustic stack includes overlapping portions of the cavity, the bottom electrode, the piezoelectric layer and the top electrode. The BAW resonator further includes a connecting strip extending from a portion of the top electrode for providing electrical excitation of the acoustic stack, where an E-field generated in the BAW resonator begins at the top electrode and terminates at the bottom electrode in response to the electrical excitation. The cavity includes an inner portion in the active region and an extended portion extending from an outer perimeter of the active region underneath the connecting strip. A length of the extended portion are sufficient to substantially prevent portions of the E-field from passing through the substrate.

Acoustic resonator including extended cavity

An acoustic resonator includes a first electrode disposed over a substrate; a piezoelectric layer disposed over the first electrode; and a second electrode disposed over the piezoelectric layer; a passivation layer disposed over the second electrode; and a ring disposed between the substrate and the passivation layer.

An acoustic resonator device includes a temperature compensation structure disposed beneath the first electrode and above the substrate.

Bulk acoustic resonator device including temperature compensation structure comprising low acoustic impedance layer

An acoustic resonator device comprises: a substrate comprising a cavity or an acoustic mirror; a first electrode disposed over the substrate; a piezoelectric layer disposed over the first electrode; and a second electrode disposed over the piezoelectric layer. The first electrode or the second electrode, or both, are made of an electrically conductive material having a positive temperature coefficient.

Temperature compensated acoustic resonator device

An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode and comprising aluminum scandium nitride, a second electrode disposed on the piezoelectric layer, and a temperature compensation feature having a temperature coefficient offsetting at least a portion of a temperature coefficient of the piezoelectric layer, the first electrode, and the second electrode.

Acoustic resonator comprising aluminum scandium nitride and temperature compensation feature

An acoustic resonator structure includes an acoustic reflector over a cavity formed in a substrate, the acoustic reflector including a layer of low acoustic impedance material stacked on a layer of high acoustic impedance material. The acoustic resonator further includes a bottom electrode on the layer of low acoustic impedance material, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and a collar formed outside a main membrane region defined by an overlap between the top electrode, the piezoelectric layer and the bottom electrode. The collar has an inner edge substantially aligned with a boundary of or overlapping the main membrane region. The layer of the low acoustic impedance material includes a temperature compensating material having a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer, the bottom electrode and the top electrode.

Acoustic resonator comprising collar and acoustic reflector with temperature compensating layer

An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.

Resonator device including electrode with buried temperature compensating layer

An acoustic resonator comprises: an acoustic resonator device comprises: a composite first electrode disposed over a substrate, the composite first electrode comprising: a first electrically conductive layer provided over the substrate; a first interlayer disposed on the first electrical conductive layer; a buried temperature compensation layer disposed over the first interlayer; a second interlayer disposed over the temperature compensation layer; a second electrically conductive layer disposed over the second interlayer, a piezoelectric layer disposed over the composite first electrode; and a second electrode disposed over the piezoelectric layer.

Temperature compensated acoustic resonator device having an interlayer

A bulk acoustic wave (BAW) resonator device includes a substrate defining a cavity, a bottom electrode formed over the substrate and at least a portion of the cavity, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. An air-wing and an air-bridge are formed between the piezoelectric layer and the top electrode, the air-wing having an inner edge that defines an outer boundary of an active region of the BAW resonator device. The BAW resonator device further includes a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer. The temperature compensation feature extends outside the active region by a predetermined length.

Acoustic resonator device with air-ring and temperature compensating layer

An acoustic resonator includes a substrate and a first composite electrode disposed over the substrate. The first composite electrode includes first and second electrically conductive layers and a first temperature compensating layer disposed between the first and second electrically conductive layers. The second electrically conductive layer forms a first electrical contact with the first electrically conductive layer on at least one side of the first temperature compensating layer, and the first electrical contact electrically shorts a first capacitive component of the first temperature compensating layer.

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Qiang Zou