Chengdu Boe Optoelectronics Technology Co., Ltd.

Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Vmware, Inc.

Tsinghua University

Shandong Yuhuang Chemical Co., Ltd.

Qiang Tang

Ren Xiong

Wei Qing

Xingguo Liu

Shaokui Liu

Huiqiang Song

Haijun Qiu

Fei Shang

Zhihui Wang

Ce Wang

Yuanzhang Zhu

Zuquan Chen

Fan Li

Yuanyuan Chai

Wei Zeng

Li Zeng

Fengxian Wang

Danping Shen

Xin Qing

Chuanyan Lan

Guoqiang Wu

Hang Min

Yichen Jiang

Xianlei Bi

Wenwei Mo

Zhaoqian Xiao

Liang Chen

Zheng Fang

Hengzhen Liang

Fangxu Cao

Weiqing Wu

Yonghong Zhou

Jing Gao

Haoran Wang

Lianbin Liu

Xiaolong Zhu

Liming Dong

Sureshbabu Koyadan Chathoth

Yue Wei

Feng Xiao

Kiran Kumar Cherivirala

Jialin Wang

Jia Deng

Jinfu Wang

Yunhan Xiao

Tiefeng Wang

Shengwei Wang

Shuangxi Chen

Xueyang Cao

Jinglei Wang

Yuqiang Wang

Tiejun Bi

Yongxiao Gao

Linhuan Yan

Shiyou Wang

Xiaolin Xu

Ashvin Lakshmikanta

Hemant Sadana

Anurag Dwivedi

Praveen Saxena

Rohit Muttepwar

Siva Polepalli

The present disclosure provides a method for manufacturing an ultra-thin glass substrate, including: providing a large glass sheet including a plurality of to-be-cut glass substrates, each to-be-cut glass substrate including a bendable region and a non-bendable region arranged at two sides of the bendable region along a first direction; cutting each to-be-cut glass substrate along an edge of the bendable region to form two slits arranged opposite to each other; performing a double-sided thinning operation on the large glass sheet, and performing an edge etching operation on the edge of the bendable region; cutting each to-be-cut glass substrate along an edge of the non-bendable region through a laser to obtain a glass substrate; performing a chemical tempering operation on the glass substrate; and performing micro-etching treatment on a surface of the chemically-tempered glass substrate. The present disclosure further provides the ultra-thin glass substrate and a display device.

Method for manufacturing ultra-thin glass substrate, ultra-thin glass substrate, and display device

An example method for managing a cell site in a 5G RAN may include determining a physical infrastructure layer, a container orchestration platform on the physical infrastructure layer, and a CNF instance associated with the 5G RAN in the container orchestration platform based on a site identifier associated with the cell site. Based on the physical infrastructure layer, the container orchestration platform, and the CNF instance, the method may include building a logical site resource map representing topological information of the cell site. Further, the method may include monitoring and/or managing the cell site using the logical site resource map.

Cell sites monitoring and/or management in 5G radio-access networks

A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.

Display apparatus

A circuit board assembly includes a connection circuit board, a near field communication antenna and solders. The connection circuit board includes circuit board pads. The near field communication antenna is attached to the connection circuit board, and the near field communication antenna includes: an antenna coil, antenna pads electrically connected to the antenna coil, and through holes penetrating the antenna pads and disposed opposite to the circuit board pads. The solders are connected to the circuit board pads through the through holes.

Circuit board assembly, display assembly and assembling method therefor, and display device

Provided is a flexible display structure, including a reinforcing strip, and a flexible display panel and a supporting layer that are laminated. The flexible display panel is provided with a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface, and the reinforcing strip is disposed on the first side surface and configured to adhere the flexible display panel to the supporting layer.

Flexible display structure, method for manufacturing the same, and display device

Some embodiments of the invention provide a method of sending data in a network that includes multiple worker nodes, each worker node executing at least one set of containers, a gateway interface, and a virtual local area network (VLAN) tunnel interface. The method configures the gateway interface of each worker node to associate the gateway interface with multiple subnets. Each subnet is associated with a namespace, a first worker node executes a first set of containers of a first namespace, and a second worker node executes a second set of containers of the first namespace and a third set of containers of a second namespace. The method sends data between the first set of containers and the second set of containers through a VLAN tunnel between the first and second worker nodes.

Per-namespace IP address management method for container networks

A display module and an electronic device are provided. The display module includes a display film layer, a heat dissipation film layer, a support plate and an elastic thermal conductive sheet. The display film layer and the heat dissipation film layer include a flat area and bending areas, and an angle exists between a tangent of a curved surface formed by the bending areas and a plane where the flat area is located. The display film layer is stacked on a first surface of the heat dissipation film layer. The support plate is connected to a position where the flat area of a second surface of the heat dissipation film layer is located, and the elastic thermal conductive sheet is connected to a position where the bending areas of the second surface of the heat dissipation film layer are located. The first surface and the second surface are opposite surfaces.

Display module and electronic device

The present disclosure provides a display apparatus, a display panel of which includes a panel chip; a second bonding region of a main circuit board is provided with second display terminals coupled with first display terminals and second touch control terminals coupled with first touch control terminals; each of segment touch control lines includes a first segment coupled between one second touch control terminal and one main connector in a first region, and a second segment coupled between a touch control chip and one main connector in a second region; a third region and a fourth region of a jumper connection circuit board are bonded with the first region and the second region respectively; the segment touch control lines are in one-to-one correspondence with jumper connection lines, each jumper connection line is coupled between one jumper connector in the third region and one jumper connector in the fourth region.

Provided are a supporting backplane and a display apparatus. The supporting backplane is arranged at one side of a flexible display panel, and the supporting backplane at least comprises a main bending area, wherein a bending axis corresponding to the main bending area extends in a first direction; the main bending area is provided with a plurality of first hollow holes, the plurality of first hollow holes being arranged in an array in the first direction and a second direction, which is orthogonal to the first direction; each of the first hollow holes is provided with a first middle hole area, and first arc-shaped hole areas located at two sides of the first middle hole area in the first direction.

Supporting backplane and display apparatus

A display device and a manufacturing method thereof are provided. The display device includes a display panel () and a flexible circuit board electrically connected with the display panel (). The flexible circuit board includes a first circuit board (), a second circuit board () and a conductive portion; the first circuit board () includes a first substrate (), and a main contact pad, a first wire () and a second wire () provided on the first substrate (); the second circuit board () includes a second substrate (), a relay contact pad and a third wire () provided on the second substrate (); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

Display device and manufacturing method thereof

Display apparatus and method for manufacturing the same

A curved surface lamination device, comprising a profiling jig (), the profiling jig () comprising a base () and a profiling portion (), with the profiling portion () being configured to support a carrier film (), and the side of the base () facing away from the profiling portion () being provided with an opening; and a lower jig (), comprising a first sinking groove (), with part of the base () being inserted into the first sinking groove (), such that the lower jig () encloses a hollow structure (E) with the base () at the opening position.

Curved surface lamination device

A display assembly and a display apparatus. The display assembly comprises a display panel, a first flexible circuit board and a fingerprint sensor, wherein the first flexible circuit board is connected to the display panel in a binding manner and is positioned on the side of the display panel that faces away from a display surface; a display signal line coupled to the display panel is arranged on the first flexible circuit board; the fingerprint sensor is fixed on the side of the first flexible circuit board that is close to the display panel, and a light-sensitive surface of the fingerprint sensor is close to the display panel; and at least some sections of at least some fingerprint identification signal lines in fingerprint identification signal lines connected to the fingerprint sensor are arranged on the first flexible circuit board.

Display assembly and display apparatus

A laminating device includes: a plate being bendable, having a resilience characteristic and for bearing the flexible substrate; a supporting base platform for supporting the plate and driving the plate and the flexible substrate on the plate to move; a bending assembly for applying stress to drive the plate and the flexible substrate on the plate to be bent towards a side, facing away from the flexible substrate, of the plate, and for releasing stress to allow the plate and the flexible substrate to rebound; and a fixing fixture for fixing the protective cover plate. The protective cover plate is used to be laminated to the flexible substrate, a shape of the fixing fixture is same as or similar to that of the protective cover plate, the fixing fixture is bent to form an accommodating space, and the protective cover plate is fixed in the accommodating space.

Laminating device and laminating method of display substrate

This disclosure provides a flexible circuit board and a manufacturing method therefor, and a display device. The flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board. The main body sub-circuit board includes a first substrate, as well as a first bridge connection end, a second bridge connection end, a first wiring portion, and a second wiring portion disposed on the first substrate. The bridge sub-circuit board includes a second substrate, as well as a third bridge connection end, a fourth bridge connection end, and a third wiring portion used for a first functional wiring, all disposed on the second substrate.

Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof

Growing community of inventors

Beijing, China

Qiang Tang