Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Shenzhen Lochn Optics Hi-tech Co., Ltd.

Qiang Song

Mei-Hua Huang

Ning Hou

Jin-Cheng Wu

Hua-Ning Wang

Rong-Chao Li

Jing Liu

Biao Li

Hao Huang

Cheng-yi Yang

Yao-Cai Li

Zu-Ai Li

Yan-qiong He

Xiaoming Guo

Xiaohui Zou

Guobin Ma

Hengshen Xu

Xue-feng She

Xiaoyun Tang

An anti-shake assembly with reduced size is disclosed which includes a circuit board, a photosensitive chip, and a magnetic component. The circuit board includes a first rigid board, a second rigid board, a plurality of connectors, and a plurality of coils. The first rigid board has a housing space. The second rigid board is movably housed in the housing space. The connectors are flexibly connected between the first rigid board and the second rigid board. The photosensitive chip and the coils are provided on the second rigid board. The magnetic component includes a base and a plurality of magnets. The base includes a central plate and a side plate. The side plate is arranged around a periphery of the central plate to form a housing space. The magnets are provided on the central plate facing the housing space. The magnets are arranged opposite to the coils.

Anti-shake assembly and manufacturing method therefor, camera module with the anti-shake assembly

A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.

Camera module having optical image stabilization function, and preparation method therefor

Embodiments of this application relate to the technical field of optical design, and disclose a method for adjusting field of view angle applied to a waveguide plate in a near-eye display equipment, the waveguide plate forms a tilt angle relative to horizontal direction of human face, the method firstly acquires refractive index, bottom angle of the waveguide plate and a required field of view angle, then calculates the tilt angle of the waveguide plate according to the refractive index and bottom angle of the waveguide plate and the field of view angle, and finally, adjusts the tilt angle to make sure the near-eye display equipment with the field of view angle; the method disclosed by this application enables the waveguide plate to realize low refractive index and large field of view angle at the same time, and features better imaging, lower cost and better stability.

Method for adjusting field of view angle and near-eye display equipment

A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Method for manufacturing circuit board with high light reflectivity

A circuit board with high light reflectivity includes an inner wiring base board, a base board with a high light reflectivity, a first insulation layer, a first conductor layer, and a second insulation layer. A first opening in the inner wiring base board receives the base board. The first insulation layer is stacked on a surface of the inner wiring base board and defines a second opening corresponding in position to the first opening and exposing a portion of the base board. The first conductor layer is on a surface of the first insulation layer away from the inner wiring base board and includes connecting pads on the base board. The second insulation layer and the second conductor are stacked in that order on another surface of the inner wiring base board. A method for manufacturing the circuit board is also disclosed.

Circuit board with high light reflectivity and method for manufacturing the same

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Shenzhen, China

Qiang Song