Tdk Corporation

Viasat, Inc.

Other

Qiang Richard Chen

Michael R Lyons

Kenneth V Buer

Hajime Kuwajima

Larry Mitchell Grela

Edwin Dizon Manalang

Ramanamurthy V Darapu

Douglas J Mathews

Algirdas Navickas

Mark S Berkheimer

Shih Peng Sun

Brandon C Drake

Kai Kai Zhao

Gary P English

A packaged semiconductor chip includes a semiconductor sub strate having formed thereon: radio-frequency (RF) input and output contact pads, DC contact pads, and first and second amplifier stages. An input of the first amplifier stage is coupled with the RF input contact pad. An input and an output of the second amplifier stage are respectively coupled to an output of the first amplifier stage and the RF output contact pad. The DC contact pads and the input of the first amplifier stages are connected via an input bias coupling path. The outputs of the amplifier stages are connected via an output bias coupling path. The chip further includes a lead frame having RF input and output pins electrically coupled to the RF input and output contact pads, and input bias pins electrically coupled to the DC contact pad.

Modularized power amplifier devices and architectures

A storage assemblyhaving a drawerand a drawer pull assemblyincluding a door handlewhich allows the drawerto selectively locked and unlocked as the drawer handleis selectively pivoted about the drawer, and a method for locking and unlocking a drawerby the selective articulation or pivoting of the drawer handle

Storage assembly with a drawer having a drawer pull assembly and a method for locking a drawer

A nested multi-stage polyphase filter can comprise: a first filter stage and a second filter stage. The first filter stage can be connected to the second filter stage via first through fourth intermediate connections. The first filter stage and the second filter stage can be laid out in a nested-ring layout. The first through fourth intermediate connections can be laid out so as to not cross over each other.

Nested multi-stage polyphase filter

The present disclosure includes systems and methods for sharing bias current. In one embodiment, shared bias current passes through a first level device to one or more second level devices along a bias current path. Multiple active devices may share bias current along a bias current path and process signal along the same or different signal paths. In one embodiment, bias current from one device is split among multiple devices. In another embodiment, bias current is combined from multiple devices into a device. Embodiments may include an interstage circuit along a signal path that improves stability of the circuit.

Circuits and methods for sharing bias current

A device according to various aspects of the present invention generally includes a surface mount device having a top side, a bottom side, a plurality of sidewalls, and a circuit comprising one or more layers. The device includes a first conductive surface covering a portion of one of the sidewalls for providing an input to the circuit, a second conductive surface covering a portion of one of the sidewalls for providing an output from the circuit, and a third conductive surface covering a portion of one of the sidewalls for providing an electrical ground to the circuit. When the surface mount device is mounted to a provided mounting surface, at least one layer of the circuit is orthogonal to the provided mounting surface.

Surface mount devices with minimum lead inductance and methods of manufacturing the same

A bandpass filter including one or more metal layers, each layer having a first region and a second region. The filter also includes two or more LC resonators and one or more coupling networks for connecting the two or more LC resonators in parallel. The two or more LC resonators are contained within the first region of the one or more layers and the one or more coupling networks are contained in the second region of the one or more layers.

Thin-film bandpass filter using inductor-capacitor resonators

The invention provides a grounding strategy for electronic components. In particular, the present provides ground connections in thin-film electronic components by connecting one group of one or more resonators to one ground connection and connecting a second group of one or more resonators to another ground connection.

Grounding strategy for filter on planar substrate

A filter is delineated that may have an input for receiving an input signal including a plurality of different frequencies and an output for passing an output signal within a first frequency band. The filter may include a circuit coupled between the input of the filter and the output of the filter such that the circuit may add one or more zeros within a second frequency band to increase attenuation of the input signal within the second frequency band. Portions of the filter may be employed to form such a circuit. The filter may be used by an electrical system employing the filter.

Filters with improved rejection band performance

A bandpass filter includes at least two thin-film layers, a first resonant circuit including a first inductor, and a second resonant circuit including a second inductor. In one embodiment, the first inductor comprises a coil having a counter-clockwise rotation positioned in two or more of the at least two thin-film layers and the second inductor comprises a coil having a clockwise rotation positioned in two or more of the at least two thin-film layer. In this case, the first inductor is coupled to the second inductor in at least one of the at least two thin-film layers when the bandpass filter is energized. In another embodiment, the first inductor has a clockwise rotation and the second has a counter-clockwise rotation positioned. In this case, the first inductor is coupled to the second inductor in at least two of the at least two thin-film layers when the bandpass filter is energized.

Growing community of inventors

Phoenix, AZ, United States of America

Qiang Richard Chen