Beijing Naura Microelectronics Equipment Co., Ltd.

Qiang Jia

Mengxin Zhao

Peijun Ding

Hougong Wang

A degassing chamber and a semiconductor processing apparatus are provided. The degassing chamber includes a chamber; a substrate container, movable within the chamber in a vertical direction; and a heating component, disposed within the chamber. A substrate transferring opening is formed through a sidewall of the chamber for transferring substrates into or out of the chamber. The heating component includes a first light source component and a second light source component. The chamber is divided into a first chamber and a second chamber by the substrate transferring opening. The first light source component is located in the first chamber, and the second light source component is located in the second chamber. The first light source component and the second light source component are provided for heating a substrate in the substrate container.

Degassing chamber and semiconductor processing apparatus

A heating chamber and a semiconductor processing apparatus are provided. The heating chamber includes: a heating barrel () disposed in the heating chamber and located above a substrate transferring window; an annular heating device () disposed around an inner side of the heating barrel and configured to radiate heat from a periphery to an interior of the heating barrel; a substrate cassette () configured to bear multiple layers of substrates and allow the multiple layers of substrates to be arranged at intervals in an axial direction of the heating barrel; and a substrate cassette lifting device () configured to drive the substrate cassette to move up into an internal spare defined by the annular heating device, or move down to a position corresponding to the substrate transferring window.

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Beijing, China

Qiang Jia