Hon Hai Precision Industry Co., Ltd.

Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.

Tencent Technology (Shenzhen) Company Limited

Huawei Technologies Co., Limited

Nvidia Corporation

Zte Corporation

Qiang Chen

Yonghai Li

Zhongli Xu

Shijun Chen

Yuanyuan Wang

Dawei Chen

Sicong Li

John Harold Drew

Xiaogang Pan

Yidu Chen

Yifei Dou

Shenglei Wang

Quan Yuan

Huiqiang Wang

Chengfeng Dong

Shiyong Wu

Xinyu Weng

Xuefeng Tian

Electronic atomizer

A method for implementing collective communication, a computer device, and a communication system are provided, to resolve problems of high communication latency and resource consumption in the conventional technology. The method includes: identifying a work request having no communication dependency, and when forwarding work requests, directly forwarding the work request identified as having no communication dependency, and forwarding, after queue management, a work request that is not identified as having no communication dependency. According to the application, communication latency caused when the work request having no communication dependency is managed by using a queue can be avoided, and resource consumption caused by performing related management can be reduced, to improve overall communication performance of collective communication.

Method for implementing collective communication, computer device, and communication system

Various embodiments of the present disclosure relate to a leaf spring for coupling a heat sink to an integrated circuit, where the leaf spring includes a central portion that has an aperture, a first spring arm that is formed on a first side of the central portion and includes a first through-hole for a first fastener, and a second spring arm that is formed on a second side of the central portion and includes a second through-hole for a second fastener. In various embodiments, a first bending axis passes through the first side and is substantially perpendicular to a longitudinal axis of the leaf spring that passes through the first through-hole and the second through-hole, and a second bending axis passes through the second side and is substantially perpendicular to the longitudinal axis of the leaf spring.

Leaf spring for an integrated circuit heat sink

Glasses

Provided are a method and device for preventing the application in an operating system from being uninstalled. The method includes monitoring the operation which creates log contents in a log system of the operating system; determining whether the operation is to uninstall the application based on the log contents; displaying a prompt whether it is agreed to uninstall the application, if the operation is to uninstall the application. Therefore, the method may prevent the malicious software from uninstalling maliciously, enhancing the security of the intelligent terminal.

Method and device for preventing application in an operating system from being uninstalled

Provided are a method and device for preventing the application in an operating system from being uninstalled. The method includes monitoring the operation executed for the application; determining whether the operation executed for the application is to uninstall the application; displaying at the client a prompt whether it is agreed to uninstall the application, if the operation executed for the application is to uninstall the application; the prompt whether it is agreed to uninstall the application may be displayed at the client after the operation executed for the application is determined to uninstall the application. Therefore, the method may prevent the malicious software from uninstalling maliciously, enhancing the security of the intelligent terminal.

An electronic device includes a chassis, a partition plate mounted in the chassis, a semiconductor refrigeration piece, a first heat sink, a second heat sink, a heat dissipation shell, and a fan. A space of the chassis is partitioned to a first space and a second space by the partition plate. The first heat sink is received in the first space, and engaged with a heating surface of the semiconductor refrigeration piece. The second heat sink is received in the second space, and engaged with a cooling surface of the semiconductor refrigeration piece. The heat dissipation shell is received in the second space, and the second heat sink is received in the heat dissipation shell. The first fan is mounted on a first end of the heat dissipation shell, and a second end of the heat dissipation pipe defines an air outlet.

Electronic device with heat dissipation equipment

A laptop computer cooling stand includes a main body, a number of semiconductor chilling plates, a number of first heat sinks, and a number of second heat sinks. The main body includes a base and a cover. The base defines a receiving space. The cover covers the receiving space and defines a number of openings. The semiconductor chilling plates are set in the receiving space. The first heat sinks are set on the semiconductor chilling plates. The first heat sinks are exposed through the opening of the cover. The second heat sinks are attached to a bottom of the base. The second heat sinks make contact with heat-dissipating sides of the semiconductor chilling plates through the base. The first heat sinks make contact with heat-collecting sides of the semiconductor chilling plates.

Laptop computer cooling stand

A heat dissipation device is mounted in a chassis of an information handling apparatus. The heat dissipation device includes a box and a cooling member, a first heat sink, a second heat sink, and a fan received in the box. A partitioning plate mounted inside the box. The box includes defines two air passage arranged at opposite sides of the partitioning plate. The cooling member is fixed to the partitioning plate. The first and second heat sinks are respectively received in the first and second air passages, and respectively abut cold and hot sides of the cooling member. The fan drives air to flow into the box through the first air passage to be cooled by the first heat sink. At the same time, the fan drives air to flow into the box through the second air passage to absorb heat from the second heat sink.

Heat dissipation device

An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Electronic device with cooling module

A keyboard includes a housing, which includes a front surface, a rear surface, and a top surface. The top surface has a key zone. A number of keys formed on the key zone. An air inlet is defined in the rear surface. A number of air outlets are defined in the key zone. A fan is received in the housing adjacent to the air inlet. The fan is configured for forcing air to flow into the housing through the air inlet. A heating element is positioned in the housing and configured to heat up the air in the housing. A switch is configured to switch on or off the heating element.

Growing community of inventors

Shenzhen, China

Qiang Chen