Palo Alto Research Center Inc.

Xerox Corporation

Leland Stanford Junior University

The United States Government As Represented by the Department of Veterans Affairs

Qian Wang

Christopher L Chua

Scott J Limb

Gregory Lewis Whiting

Rene A Lujan

Jengping Lu

Eugene Michael Chow

Yu Wang

Sean Roark Garner

Sylvia Joan Smullin

William H Robinson

Yunda Wang

Jeremy Sokolove

Jeng Ping Lu

Brent Shawhan Krusor

Sourobh Raychaudhuri

Norine E Chang

A microspring includes a film stack having a base disposed on a build plane and a spring member extending from the base. The film stack includes a compressive layer, a substantially stress-free layer, and a tensile layer. The film stack is formed of one or more materials that become superconducting below 140 K. A stress gradient in the film stack causes the spring member to curl away from the build plane of the base.

Stress engineered microspring for cryogenic superconducting circuits

An electronic assembly and methods of making the assembly are disclosed. The electronic assembly includes a substrate with an elastic member having an intrinsic stress profile. The elastic member has an anchor portion on the surface of the substrate; and a free end biased away from the substrate via the intrinsic stress profile to form an out of plane structure. The substrate includes one or more spacers on the substrate. The electronic assembly includes a chip comprising contact pads. The out of plane structure on the substrate touches corresponding contact pads on the chip, and the spacers on the substrate touch the chip forming a gap between the substrate and the chip.

Spacers formed on a substrate with etched micro-springs

A release layer is formed on a surface of an integrated circuit wafer. The surface is passivated and includes metal contact materials. A stress-engineered film having an intrinsic stress profile is deposited over the release layer. The stress-engineered film is patterned and the release layer is undercut etched so that a released portion of the patterned stress-engineered film is released from the surface while leaving an anchor portion fixed to the surface. The intrinsic stress profile in the stress-engineered film biases the released portion away from the surface. The released portion is placed entirely within an area defined by the metal contact material.

Micro-fabricated, stress-engineered members formed on passivation layer of integrated circuit

MicroLED chips are transferred from an epitaxy wafer to a first coupon substrate. The first coupon substrate has a first, soft adhesive layer that temporarily holds the microLED chips. Using a first transfer substrate, a subset of the microLED chips are transferred from the first coupon substrate to a second coupon substrate having a second, soft adhesive layer. A pattern of microLED chips are transferred from another substrate to the second coupon substrate via a second transfer substrate to fill vacancies in the subset of microLED chips. The transfer substrates are operable to hold and release pluralities of micro objects.

Method and system for assembly of micro-LEDs onto a substrate

Transfer elements include an adhesion element having a higher Young's modulus at a lower temperature and a lower Young's modulus at a higher temperature. Heating elements are operable to change an operating temperature of each adhesion element in response to an input. A controller is coupled to provide the inputs to the heating elements to cause a change in temperature at least between the higher and lower temperature. The change in temperature causes the transfer elements to selectably hold objects to and release the objects in response to changes between the higher and lower Young's moduli of transfer elements.

Transfer elements that selectably hold and release objects based on changes in stiffness

A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.

Self-limiting electrical triggering for initiating fracture of frangible glass

A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.

Method of forming a photodiode

Sensor and heater for stimulus-initiated fracture of a substrate

A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive layer is disposed over the elastic portions and the anchor portions. The device includes one or more electrically conductive stubs that extend between two adjacent anchor portions without electrically connecting the two adjacent anchor portions.

Out of plane structures and methods for making out of plane structures

Compositions and methods are provided for inhibiting or treating the early and established stages of inflammatory diseases by administration of an effective dose of the desethylhydroxychloroquine (DHCQ). A benefit of the methods is the ability to deliver a dose of agent that is effective in treating inflammation while sparing the individual from retinal toxicity.

Desethylhydroxychloroquine for the treatment of diseases associated with inflammation

An article includes a support substrate bonded to heterostructure epitaxial layers that include one or more electronic devices. The support substrate has a bonding surface and the heterostructure epitaxial layers have a surface with the epitaxial growth direction of the heterostructure epitaxial layers towards the surface. The surface of the heterostructure epitaxial layers is bonded at the bonding surface of the support substrate by ion exchange between the surface of the heterostructure epitaxial layers and the bonding surface of the support substrate.

Growing community of inventors

Mountain View, CA, United States of America

Qian Wang