Hewlett-Packard Development Company, L.p.

Avago Technologies General IP (Singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Qian Tao

Nick Su

Boon Keat Tan

Gek Yong Ng

Richard Lum Kok Keong

Chung Chiet Edwin Chin

Fun Kok Chow

Yu Ri Kim

Wesley Chia

Katherine Weilbacher

Shanthamallappa Kiran Kattesomanahalli

Khim Yam Lim

Yee Mei Cheng

Tee Kiang Phang

Jiajin Wu

Dominique Ho

Kok Chai Chong

Deyang Wang

Kwee Chong Chang

Peng Siang Seet

Richard Lum

Jang Wei Chao

Adnil San Dela Pena Sazon

Daniel L Barr

Ricky Chow

Joshua B Tamsky

Mylene A K Tjin Wong Joe

In some examples, the disclosure describes device that includes a moveable carriage, a supply manifold releasably coupled to the moveable carriage utilizing a locking mechanism, and a trigger arm coupled to the supply manifold to move the supply manifold a distance away from the moveable carriage while the locking mechanism is in an unlocked position.

Supply manifold trigger arms

Examples of an imaging device () are described herein. In an example, the imaging device () includes a drive control assembly (), a first drive assembly (), a second drive assembly (), a movable carriage (), and a locking mechanism (). The drive control assembly () can be used to regulate transmission of drive from an actuator () to the first drive assembly () and the second drive assembly (). The locking mechanism () can lock the drive control assembly () in an engaged position with the first drive assembly () or the second drive assembly (). The movable carriage () can actuate the locking mechanism () to lock the drive control assembly () in the engaged position.

Imaging devices with drive assembly and drive assembly locking mechanism

In one embodiment, an isolation device has a substrate, a metal plate, a conductive layer, first and second isolation layers are disclosed. The conductive layer may be formed within the substrate. The conductive layer may be arranged coupled to the metal plate, so as to receive a capacitively coupled signal from the metal plate. The first and second isolation layers may be sandwiched between the metal plate and the conductive layer. In another embodiment, an isolation device comprising a semiconductor substrate, a topmost metal layer and a plurality of additional metal layers is disclosed. The isolation device further comprises an isolation capacitor formed using the topmost metal layer and a conductive layer coupled to at least one of the plurality of additional metal layers.

Isolation device

An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The plurality of metal layers have a topmost metal layer disposed furthest away from the substrate and a first interconnect metal layer formed nearest to the substrate. The first interconnect metal layer is disposed at a first distance away from the substrate, whereas the topmost metal layer is disposed at an isolation distance away from a first adjacent metal layer formed nearest to the topmost metal layer. A portion of the topmost metal layer forms a first plate. The first plate is configured to transmit the first signal from the first circuit to a second plate that is connected to the second circuit, but electrically isolated from the first plate.

An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The isolation device comprises a first plate that is electrically coupled to the first circuit, and a second plate that is electrically coupled to the second circuit. The first plate is configured to transmit the first signal from to a second plate that is electrically isolated from the first plate. The first plate and the second plate is surrounded by an isolation material. The isolation device further comprises at least one trench that extend at least partially through the isolation material in a direction that is substantially perpendicular to the first plate and the second plate. The at least one trench may circumscribe one of the first plate and the second plate.

An isolation system, isolation capacitor, and Integrated Circuit are disclosed. The isolation capacitor is described to include a first capacitive element, a second capacitive element, a primary isolation layer positioned between the first and second capacitive elements, as well as a secondary isolation layer positioned between the first and second capacitive elements. The secondary isolation layer has an area that is larger than an area of one or both of the first and second capacitive elements, thereby reducing the likelihood of breakdown between the first and second capacitive elements.

Silicon designs for high voltage isolation

Various embodiments of systems for transmitting and receiving a plurality of signals across an isolation material are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal using amplitude modulation. In another embodiment, a first signal and a second signal are modulated into a modulated signal before being modulated further using amplitude modulation. The detection of the modulated signal may be performed using a frequency detector and an amplitude detection circuit that are arranged in parallel. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques to provide, for example, at least one or more integrated circuits.

Transmitting and receiving digital and analog signals across an isolator using amplitude modulation

Imaging device

A sigma-delta converter, analog-to-digital conversion system, and an Integrated Circuit (IC) chip are disclosed that include a main sigma-delta modulator and an auxiliary sigma-delta modulator. The auxiliary sigma-delta modulator is electrically matched with the main sigma-delta modulator and is configured to generate an output that is incorporated into a feedback loop of the main sigma-delta modulator to enable the main sigma-delta modulator to adjust an offset signal applied at a main analog channel.

Dynamic offset cancellation in sigma-delta converter

An image scanner includes a main body and a lid. The main body includes a scan window. The scan window is covered by the lid when the lid is closed and is exposed when the lid is open. A lid position detector detects whether the lid is open or closed.

Lid position detector for an image scanner

In one embodiment, an isolation device has a substrate, a metal plate, a conductive layer, first and second isolation layers are disclosed. The conductive layer may be formed within the substrate. The conductive layer may be arranged coupled to the metal plate, so as to receive a capacitively coupled signal from the metal plate. The first and second isolation layers may be sandwiched between the metal plate and the conductive layer. In another embodiment, an isolation device having a semiconductor substrate, a topmost metal layer and a plurality of additional metal layers is disclosed. The isolation device further has an isolation capacitor formed using the topmost metal layer and a conductive layer coupled to at least one of the plurality of additional metal layers.

Various embodiments of an optical proximity sensor and corresponding circuits and methods for measuring small AC signal currents arising from the detection of pulsed AC light signals emitted by a light emitter and reflected from an object to detected in the presence of larger ambient light DC current signals are disclosed. Circuits and corresponding methods are described that improve the dynamic range, sensitivity and detection range of an optical proximity sensor by cancelling the contributions of DC current signals arising from ambient light signals that otherwise would dominate the detected small AC signal currents. The DC signal cancellation occurs in a differential amplifier circuit before small AC signal currents are provided to an analog-to-digital converter. The circuits and methods may be implemented using conventional CMOS design and manufacturing techniques and processes.

Growing community of inventors

Singapore, Singapore

Qian Tao