Hisense Broadband Multimedia Technologies Co., Ltd.

Hisense USA Corporation

Hisense International Co., Ltd.

Qian Shao

Tao Wu

Jianwei Mu

Jihong Han

Yongzheng Tang

Guangchao Du

Sitao Chen

Shaoshuai Sui

Benzheng Dong

Fabu Xu

Bangyu Yu

Xiangxun Sun

Xuxia Liu

Yongliang Huang

Sigeng Yang

Wei Cui

Hongchao Pan

Peng He

Baofeng Si

Weiwei Liu

Liu Yang

Fenglai Wang

Jianwei Yao

Honghao Jiao

Chengshuang Luo

The present disclosure discloses an optical module including a circuit board and a light-emitting assembly. In the light-emitting assembly, a wavelength tuning mechanism is formed of a semiconductor optical amplification chip, a silicon optical chip and a semiconductor refrigerator. The semiconductor optical amplification chip may provide a plurality of wavelengths, and a wavelength selection is carried out by an optical filter in the silicon optical chip; a temperature adjustment for the optical filter is achieved by the semiconductor refrigerator, so as to further adjust a performance of the filter for wavelength selection. The above device is provided in a housing to facilitate packaging of the devices.

Optical module

An optical module includes a housing, a circuit board, a package, and at least one of a light-emitting assembly or a light receiving assembly. The package includes a package body and a soldering member. The package body includes a cavity. An end of the circuit board is inserted into the cavity, and the soldering member is located in a gap between the circuit board and the package body. The light-emitting assembly or the light receiving assembly is located in the cavity and electrically connected to the circuit board. The light-emitting assembly is configured to convert an electrical signal from the circuit board into an optical signal and emit the optical signal to an outside of the optical module, and the light receiving assembly is configured to convert the optical signal from the outside of the light module into an electric signal and transmit the electric signal to the circuit board.

An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly and a claw assembly. The lens assembly includes a lens base and a connecting part. The lens base covers the at least one of the light-transmitting chip or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The connecting part includes at least one positioning slot disposed on a surface of the connecting part facing away from the lens base. The claw assembly includes a claw and a through hole. The claw includes at least one positioning protrusion disposed on a surface of the claw facing the connecting part. The through hole is configured to be connected to an optical fiber outside the optical module.

An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The laser assembly and the silicon optical chip are located on the base. The laser assembly includes an upper box, conductive substrates, laser chips and a light transmitting member. The upper box and the base are combined to provide a cavity. The cavity has an opening and a slot. The laser chips are located on the conductive substrates which are at least partially located in the cavity. The light transmitting member is disposed between the upper box and the base, and is configured to enclose the opening. Light exit surfaces of the laser chips are parallel to a light incident surface of the light transmitting member, and the light incident surface and a light exit surface of the light transmitting member are not parallel.

Optical module having laser chips illuminating a light transmitting member with a parallel incident surface and a non-parallel exit surface

An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The circuit board is disposed between an upper shell and a lower shell of the shell. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly and the silicon optical chip are located on the base. An upper box of the laser assembly and the base are combined to provide a cavity. Conductive substrates of the laser assembly are at least partially located in the cavity. Laser chips of the laser assembly are located on the conductive substrates. An opening of the cavity is located in an optical path where light emitted by the laser chips is emitted to the silicon optical chip, and a slot of the cavity allows the conductive substrates or wires to extend out of the cavity.

Optical module with slotted laser assembly box

An optical module includes a shell, a circuit board, a base, a laser assembly, a silicon optical chip and a protective cover. The laser assembly and the silicon optical chip are located on the base. The protective cover covers on the circuit board. The laser assembly and a wiring region of the laser assembly and/or the silicon optical chip and a wiring region of the silicon optical chip are encapsulated between the protective cover and the circuit board. The shell includes at least one heat conduction column, the at least one heat conduction column is disposed on an inner wall of the shell and is in thermal conductive connection with the laser assembly and/or the silicon optical chip. The protective cover includes at least one escape opening that allow the at least one heat conduction column to pass and enter an inside of the protective cover.

Optical module with structured protective cover

An optical module includes: a circuit board with a recess; a laser box disposed in the recess and electrically connected to the circuit board; a fiber ribbon, wherein one end of the fiber ribbon is connected to the laser box; and a silicon photonic chip electrically connected to the circuit board and to the other end of the fiber ribbon. The laser box includes: a flat base disposed in the recess, with one end of the flat base being coupled to the fiber ribbon; a conductive substrate disposed at the other end of the flat base and electrically connected to the circuit board; a laser chip attached on the conductive substrate; and an upper cover including a top plate and side plates, so that the upper cover caps/is covered on the flat base. A fitting between the flat base and the upper cover facilitates assembly of the conductive substrate and the laser chip in the laser box.

An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.

This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.

The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

Growing community of inventors

Qingdao, China

Qian Shao