Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Beijing University of Posts and Telecommunications

Intel Corporation

Google Inc.

Lsi Corporation

Beijing Boe Display Technology Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Boe Mled Technology Co., Ltd.

Hefei Boe Ruisheng Technology Co., Ltd.

Sinovation (beijing) Medical Technology Co., Ltd

Qi Qi

Minghua Xuan

Dongni Liu

Jing Liu

Haoliang Zheng

Liang Chen

Li Xiao

Hao Chen

Jiao Zhao

Zhenyu Zhang

Zhanfeng Cao

Lijun Yuan

Xinhong Lu

Jing Wang

Ming Yang

Han Yue

Wanzhi Chen

Fuqiang Li

Seungwoo Han

Xiaochuan Chen

Guangcai Yuan

Fei Wang

Ning Cong

Zhengliang Li

Kun Zhao

Jamyuen Ko

Ke Wang

Xue Dong

Can Zhang

Can Wang

Ke Fei Wang

Ce Ning

Zhiwei Liang

Hehe Hu

Yanan Niu

Yi Tao

Nianqi Yao

Jie Huang

Jiayu He

Fan Zhang

Shaohua Yang

Changfeng Li

Feng Qu

Jianguo Wang

Chunping Long

Li Li

Song Liu

Chung-Li Wang

Ting Zeng

Meili Wang

Wonjae Choi

Liping Lei

Jiushi Wang

Jinfei Niu

Xuan Liang

Lubin Shi

Wei Li

Meng Li

Shu Li

Feng Zhang

Lei Chen

Shi Shu

Lili Wang

Kuanjun Peng

Wei Guo

Huan Wang

Haifeng Hu

Liang Gao

Peng Xu

Xiao Wang

Yingwei Liu

Rui Han

Chao Liu

Haixu Li

Hongwei Tian

Feng Guan

Fangzhen Zhang

Bing Zhang

Jiaxiang Zhang

Jie Xu

Huan Liu

Yichi Zhang

Ming Zhai

Jie Yu

Yan Chen

Jian Yang

Yu Jiang

Guoqiang Wang

Dapeng Xue

Jingjing Zhang

Pengtao Li

Wei Hao

Xiaoyan Zhu

Lin Zhou

Hu Meng

John W Kaehler

Zhaohui Qiang

Ken Foo

Junwei Yan

A substrate includes a base substrate, at least two bonding pads are arranged on the base substrate, the base substrate and an electronic element are bonded to each other through the at least two bonding pads, at least two pins are arranged on the electronic element, a protective layer is arranged at a side of the bonding pads away from the base substrate, and an opening region is arranged in the protective layer at each bonding pad, to expose partial surface of the bonding pad. A bonding combination layer made of a low-melting-point alloy material is arranged in the opening region, and the low-melting-point alloy material is capable of being melted at a first predetermined temperature, to enable the bonding pads and the pins to be bonded to each other.

Substrate, method for forming the same, display device and for forming the same

Provided is a display substrate including a substrate and a plurality of light emitting units and a plurality of light detection units located on the substrate, At least one light emitting unit includes a light emitting element and a pixel circuit connected to the light emitting element, and at least one light detection unit includes an optical sensing element and a light emitting detecting circuit connected to the optical sensing element. At least one inorganic hydrogen barrier layer is arranged on one side of the optical sensing element close to the substrate. The light emitting element has a first light emitting region and a second light emitting region, the first light emitting region of the light emitting element emits light from a side away from the substrate, and the second light emitting region of the light emitting element emits light from a side close to the substrate.

Display substrate, manufacturing method thereof, and display apparatus

A pixel driving circuit includes a driving control sub-circuit and a time control sub-circuit. The driving control sub-circuit includes a first driving sub-circuit. The first driving sub-circuit is configured to output a driving signal to drive an element to be driven to operate. The time control sub-circuit includes a second driving sub-circuit. The second driving sub-circuit is configured to output a third voltage signal to make the first driving sub-circuit stop outputting the driving signal, so as to control operating duration of the element to be driven.

Pixel driving circuit and driving method therefor, and display panel

An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

Array substrate and manufacturing method therefor, display panel, and backlight module

A circuit board includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer includes a plurality of first conductive portions. The second conductive layer includes a plurality of second conductive portions. A second conductive portion passes through a first via hole in the first insulating layer to be in electrical contact with a first conductive portion. The first conductive layer and the second conductive layer each include at least one main conductive layer, which is capable of creating a first intermetallic compound with solder. At least one of the first conductive layer and the second conductive layer further includes a stop layer capable of creating a second intermetallic compound with the solder. A rate of a reaction between the stop layer and the solder is lower than a rate of a reaction between the main conductive layer and the solder.

Circuit board, light-emitting substrate, backlight module, and display apparatus

A display backplane is provided, including a base, wherein pixel circuits, bonding electrodes, and bonding connection wires are on the base; the bonding electrodes are coupled to the bonding connection wires in a one-to-one correspondence; the bonding electrodes and the bonding connection wires are on two opposite surfaces of the base; the pixel circuits and the bonding connection wires are on a same side of the base; one end of each bonding connection wire is coupled to the bonding electrode through the first via in the base; the other end of each of at least some bonding connection wires is coupled to the pixel circuit; and an orthographic projection of at least one of the bonding electrodes and the bonding connection wires on the base is not coincident with an orthographic projection of the pixel circuit on the base.

Display backplane and manufacturing method thereof and display device

Embodiments of the present disclosure provide an array substrate and a display apparatus. The array substrate includes: a base substrate; a conductive layer located on the base substrate, where a material of the conductive layer includes copper; and an oxidization protective layer, located on a side, facing away from the base substrate, of the conductive layer; where a material of the oxidization protective layer includes tungsten.

Array substrate and display apparatus comprising oxidization protective layer on copper conductive layer

A light emitting device and a light emitting apparatus are provided. The light emitting device includes at least two epitaxial structures provided in a first direction and connected in series, wherein two current diffusion layers and a transparent adhesive layer are provided between two adjacent epitaxial structures, a current diffusion layer is provided at one side of each of the two adjacent epitaxial structures, the transparent adhesive layer is provided between the two current diffusion layers, and metal nanoparticles are provided in the transparent adhesive layer.

Light emitting device and light emitting apparatus

A drive method for a display panel, wherein the display panel includes a plurality of current data lines, a plurality of time-length data lines, a first current selection signal line, a second current selection signal line, a first time-length selection signal line and a second time-length selection signal line, at least one current data line is connected with the first current selection signal line or the second current selection signal line, and at least one time-length data line is connected with the first time-length selection signal line or the second time-length selection signal line; the method includes: providing a valid level signal to the first time-length selection signal line, the second time-length selection signal line, the first current selection signal line and the second current selection signal line.

Pixel circuit and driving method thereof, and display panel and driving method thereof

An array substrate includes a base substrate including a first surface and a second surface, scanning signal lines disposed on the first surface, at least two groups of shift register circuits disposed in a display area of the first surface, and at least one fan-out structure disposed on the second surface. Each scanning signal line extends along a first direction. Each group of shift register circuits includes a plurality of shift register circuits along a second direction. Each shift register circuit is coupled to a scanning signal line. The fan-out structure is coupled to the shift register circuits. At least one group of shift register circuits is disposed in a non-edge region of the display area. The shift register circuit disposed in the non-edge region is configured to transmit a scanning signal to the scanning signal line at both sides of the shift register circuit along the first direction.

Array substrate and method of manufacturing the same, pixel driving method, and display panel

An array substrate has a display area and includes at least one pixel group, at least one pixel circuit group and at least one shift register circuit. The at least one pixel group is disposed in the display area. Each pixel group includes a plurality of pixels arranged in an array. Each pixel circuit group is disposed between two adjacent rows of pixels or two adjacent columns of pixels in a corresponding pixel group. Each pixel circuit group includes at least one pixel driving sub-circuit group. A shift register circuit is disposed between two rows of pixels or two columns of pixels that are different from two rows of pixels or two columns of pixels between which a pixel driving sub-circuit group is disposed.

Array substrate, display panel, spliced display panel and display driving method

A display panel includes a backplane, back traces, side traces and blocking portions. The backplane includes a display surface, a non-display surface, and side surfaces connected to the two surfaces, where a side surface is a selected side surface. The back traces and the blocking portions are arranged on the non-display surface. Each back trace includes a first line segment and a second line segment, whose extension directions intersect. The side traces are arranged on the selected side surface. Of each side trace, an end is on the display surface, and the other end is on the non-display surface. Each side trace is electrically connected to a first line segment in a respective back trace, where the first line segment has the same extension direction as the other end of each side trace. Two adjacent first line segments are provided with a blocking portion therebetween.

Display panel, display device and tiled display apparatus

A display substrate and a display device are provided. The display substrate includes light emitting diode chips, each light emitting diode chip includes light emitting units which respectively emit light of different colors, each light emitting unit includes a first electrode, a light emitting layer, a base and a second electrode, and the base and the second electrode are respectively located at both sides of the light emitting layer. In each light emitting diode chip, the light emitting units share the base and the first electrode, the light emitting layers of the light emitting units emit light of the same color, and at least one light emitting unit further includes a first color conversion layer located at a side of the base away from the light emitting layer, so as to convert first color light emitted by the light emitting layer into second color light.

Display substrate and display device

A substrate, a backlight module, and a display apparatus, which relates to the technical field of display. The substrate is configured to display or provide a backlight, and the substrate includes: a bonding region (OB) and a plurality of light-emitting regions (OA); each of the plurality of light-emitting regions (OA) includes a first metal layer () and a first conductive adhesive () located on the first metal layer (), the first conductive adhesive () is a photo-curing conductive adhesive; and the bonding region (OB) includes a second metal layer () and a second conductive adhesive () located on the second metal layer ().

Substrate, backlight module, and display apparatus

A folding device and a folding method are provided. The folding device includes a bearing and fixing mechanism configured to bear and fix a main body portion of a to-be-folded device; a folding mechanism disposed on at least one lateral side of the bearing and fixing mechanism, the folding mechanism being configured to bear a to-be-folded portion of the to-be-folded device and fold the to-be-folded portion to one side in a thickness direction of the main body portion; a first driving mechanism configured to drive the folding mechanism to move along a direction perpendicular to a bearing surface, which bears the main body portion, of the bearing and fixing mechanism; and a second driving mechanism configured to drive the folding mechanism to move close to or away from the bearing and fixing mechanism along a direction parallel to the bearing surface.

Folding device and folding method

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Beijing, China

Qi Qi