Qualcomm Mems Technologies, Inc.

Maxim Integrated Products, Inc.

Other

Qi Luo

Joy T Jones

Sean S Cahill

Ronald Bonshaw Koo

Sudarsan Uppili

Albert Song

Xiaoming Yan

Paul G Schroeder

Evgeni Petrovich Gousev

Gang Xu

Chun-Ming Wang

Lior Kogut

Fan Zhong

David Leslie Heald

Henry Grage

Chih-Wei Chiang

Thanh Nghia Tu

Sriram Akella

Qiuxian Tai

Chia Wei Yang

A sensor package, a sensor system, and a method for fabricating the sensor package are described that include a sensing chip having dispense chemistry disposed over an array of conductive elements. In an implementation, the sensor package may include a sensing chip that may include at least one conductive element, wherein the at least one conductive element may be part of an array of conductive elements defining a M by N matrix, where M is a number of rows of the at least one conductive element and N is a number of columns of the at least one conductive element. The sensing chip may further include dispense chemistry that may be disposed on the at least one conductive element and at least one contact pad. The sensor package may further include a microfluidic cap that may be positioned over at least a portion of the sensing chip, wherein the microfluidic cap and the sensing chip may define a cavity that may be configured to receive a fluid sample. The microfluidic cap may further include at least one electrode that may be configured to sense an analyte in the fluid sample. The at least one electrode may be coupled to the at lease one contact pad of the sensing chip via a conductive adhesive.

Analyte sensor package and method for analyzing fluid samples

A sensor system includes an assay chamber configured to receive a fluid sample. Dispense chemistry disposed within the assay chamber. A first electrode structure includes at least one conductive element and a second electrode structure proximate to the first electrode structure is configured to transmit an electrical signal through the fluid sample. The first electrode structure is configured to receive the electrical signal transmitted through the fluid sample and responsively generate a sense signal. The sense signal being indicative of an interaction of the fluid sample with the dispense chemistry. A controller is electrically coupled to the first electrode structure and configured to identify at least one analyte in the fluid sample based on at least the sense signal generated by the first electrode structure. The first electrode structure is embedded within a base substrate and the second electrode structure is embedded within a microfluidic cap that is coupled to the base substrate.

Analyte sensor package with dispense chemistry and microfluidic cap

Methods of making a microelectromechanical system (MEMS) device are described. In some embodiments, the method includes forming a sacrificial layer over a substrate, treating at least a portion of the sacrificial layer to form a treated sacrificial portion, forming an overlying layer over at least a part of the treated sacrificial portion, and at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity.

Eliminate release etch attack by interface modification in sacrificial layers

A method of manufacturing an array of miniaturized spring contacts is disclosed. The invention teaches a symmetric design of the spring contact with two anchoring traces at each side of the spring contact, and teaches a method of forming the spring contact with a continuous, zero-stress core member throughout the entire body of the spring contact; besides these, the invention enables easy manufacturing of integrated fine pitch spring contact arrays, allows fabrication of such spring contact arrays with extremely uniform spring height and good electrical and mechanical properties.

Method of manufacturing a plurality of miniaturized spring contacts

A thin black mask is created using a single mask process. A dielectric layer is deposited over a substrate. An absorber layer is deposited over the dielectric layer and a reflector layer is deposited over the absorber layer. The absorber layer and the reflector layer are patterned using a single mask process.

Device having thin black mask and method of fabricating the same

An interferometric spatial light modulator comprises of two cavities. One is the optical resonant cavity having a partially reflective film and a movable reflective membrane as two walls, and the other is the electromechanical actuation cavity having the movable reflective membrane and a bottom metal layer as electrodes. The spatial light modulator is built on silicon substrate and is actively addressed. A microdisplay apparatus of such spatial light modulators and a projection display system using such microdisplay are also disclosed.

Spatial light modulator

Methods and apparatus for reducing back-glass deflection in an interferometric modulator display device are provided. In one embodiment, an interferometric modulator display is provided that includes a including a substrate, an optical stack formed on the substrate, a moveable reflective layer formed over the optical stack, and a backplate attached to the substrate. The moveable reflective layer includes one or more first posts extending therefrom, in which one or more of the first posts are operable to protect the moveable reflective layer by contacting at least a portion of the backplate if the backplate is deflected.

Method and apparatus for reducing back-glass deflection in an interferometric modulator display device

Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Voids are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. The voids are formed to extend through less than the entire thickness of the layer where they are being formed. Other layers may be formed over the formed voids. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

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Cupertino, CA, United States of America

Qi Luo