Western Digital Technologies, Inc.

Shanghaitech University

Qi Deng

Chin-Tien Chiu

Cong Zhang

Hui Wang

Hao Sun

Yajun Ha

Junrong Yan

Weili Wang

Xuyi Yang

Xin Lu

Xiaofeng Di

CheeKeong Chin

Chaur Yang Ng

Chenlin Yang

A normal distributions transform (NDT) method for LiDAR point cloud localization in unmanned driving is provided. The method proposes a non-recursive, memory-efficient data structure occupation-aware-voxel-structure (OAVS), which speeds up each search operation. Compared with a tree-based structure, the proposed data structure OAVS is easy to parallelize and consumes only about 1/10 of memory. Based on the data structure OAVS, the method proposes a semantic-assisted OAVS-based (SEO)-NDT algorithm, which significantly reduces the number of search operations, redefines a parameter affecting the number of search operations, and removes a redundant search operation. In addition, the method proposes a streaming field-programmable gate array (FPGA) accelerator architecture, which further improves the real-time and energy-saving performance of the SEO-NDT algorithm. The method meets the real-time and high-precision requirements of smart vehicles for three-dimensional (3D) lidar localization.

Normal distributions transform (NDT) method for LiDAR point cloud localization in unmanned driving

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Semiconductor device including vertical wire bonds

A substrate-less integrated electronic element module for a semiconductor package, comprising: at least two electronic elements, each of the at least two electronic elements having first electrical connectors; and a first molding compound encapsulating the at least two electronic elements, the first molding compound comprising a first planar surface and an opposing second planar surface of the integrated electronic element module, wherein each of the first electrical connectors is directly exposed on the first planar surface of the integrated electronic element module. Further, a semiconductor package including the integrated electronic element module and the method of fabricating the same is provided.

Integrated electronic element module, semiconductor package, and method for fabricating the same

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Shanghai, China

Qi Deng