Heptagon Micro Optics Pte. Ltd.

Ams Sensors Singapore Pte. Ltd.

Qi Chuan Yu

Ji Wang

Hartmut Rudmann

Kam Wah Leong

Jens Geiger

Simon Gubser

Stephan Heimgartner

Xu Yi

Susanne Westenhöfer

John A Vidallon

Thng Chong Kim

Sonja Hanselmann

Christoph Friese

Kyu Won Hwang

Jukka Alasimiö

An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.

Optoelectronic modules including an optical emitter and optical receiver

An optical module comprising: a plurality of active optoelectronic components each one mounted on a respective printed circuit board (PCB), wherein each active optoelectronic component is associated with a respective different optical channel; a plurality of optical assemblies, each one is substantially aligned over a different respective optical channel; and a spacer separating the active optoelectronic components and PCBs from the optical assemblies, wherein the optical assemblies are attached by adhesive directly to an optical assembly-side surface of the spacer. A first active optoelectronic component is separated, by the spacer, from a first optical assembly by a first distance and a second active optoelectronic component is separated, by the spacer, from a second optical assembly by a different second distance. Also contemplated is a method for fabricating an optical module that comprises: modifying a height of one or more extensions on a spacer to adjust for at least one of a focal length or tilt of at least one optical channel.

Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules

Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Optoelectronic modules that have shielding to reduce light leakage or stray light

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Singapore, Singapore

Qi Chuan Yu