Asml Netherlands B.v.

Putra Saputra

Thibault Simon Mathieu Laurent

Johan Gertrudis Cornelis Kunnen

Rogier Hendrikus Magdalena Cortie

Ruud Hendrikus Martinus Johannes Bloks

Roy Werkman

Adrianus Hendrik Koevoets

Jim Vincent Overkamp

Christianus Wilhelmus Johannes Berendsen

Erik Jensen

Patricius Jacobus Neefs

Michael Johannes Hendrika Wilhelmina Renders

Pieter Gerardus Jacobus Smorenberg

Theo Wilhelmus Maria Thijssen

Paul Derwin

Rowin Meijerink

Khalid Elbattay

Ma Su Su Hlaing

Bo Zhong

Masaya Komatsu

Hyun-Woo Yu

A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.

Sub-field control of a lithographic process and associated apparatus

A lithographic apparatuscomprisingincludesan object tablewhich carries an object. The lithographic apparatus may furthercomprise at least oneinclude asensoras part of a measurement systemto measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimatetheadeformation oftheanobject due toavaryingloadsloadduring operation of the lithographic apparatus, for exampleavaryingloadsloadinduced by a two-phase flow in a channel formedwithinofthe object table.Additionally, or alternatively, theThelithographic apparatuscomprisesmay includea predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation. The positioning of a projection beam, used toprovide apatterna substrate, can be controlled relative to the object, to alter the position of the pattern and/or the projection beam on the substrate, based on the estimated deformation.

Lithographic apparatus and an object positioning system

A lithographic apparatus comprising an object table which carries an object. The lithographic apparatus may further comprise at least one sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the deformation of the object due to varying loads during operation of the lithographic apparatus, for example varying loads induced by a two-phase flow in a channel formed within the object table. Additionally, or alternatively, the lithographic apparatus comprises a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation. The positioning of a projection beam, used to pattern a substrate, can be controlled relative to the object, to alter the position of the pattern and/or the projection beam on the substrate, based on the estimated deformation.

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Putra Saputra