Airbus Group India Private Limited

Airbus Engineering Centre India

Punit Tiwari

Shreesh Mishra

Sunil Kumar

Madhusudhana Reddy

Tim Giese

Vikram Singh Mangat

Madhusudana Reddy

Sandhya Jha

Krishan Chugh

Andreas Wick

Jose-Angel Hernanz Manrique

A system and method for extracting relevant computational data are disclosed. In one embodiment, one or more physical quantities and/or one or more functions of physical quantities of interest, associated with a larger volume, to be measured are identified. Further, any non-available identified functions of physical quantities are computed for each smaller volume of the larger volume using the available physical quantities in the computational data. Furthermore, regions in computational domain are identified along with ranges of identified physical quantities and functions of physical quantities of interest for carrying out the extraction from the computational data. Moreover, geometrical and connectivity information of smaller volumes associated with the identified regions/ranges that are obtained by filtering the computational data associated with the larger volume are obtained. Also, one or more clusters of smaller volumes are obtained using the obtained geometrical and connectivity information of smaller volumes associated with the identified regions/ranges.

System and method for extracting relevant computational data for design analysis and validation

A technique for performing thermal analysis of an electronics rack is disclosed. In one embodiment, the electronics rack having multiple heat generating components is modeled. Further, thermal boundary conditions for each of the heat generating components are computed, by a computation fluid dynamics tool (CFD) tool, based on an initial temperature and a heat flux corresponding to each of the heat generating components in a first cycle, upon modeling the electronics rack. Furthermore, an actual temperature of each of the heat generating components is determined, by a one dimensional (1D) tool, using the computed thermal boundary conditions for estimating heat dissipated by each of the heat generating components in the first cycle.

Thermal analysis of electronics racks

A system and method for computing thermal boundary conditions from an unstructured computational fluid dynamics (CFD) simulation for a thermal simulation of a structural component are disclosed. The thermal boundary conditions include convective heat transfer coefficient (HTC) and reference temperature (T). In one embodiment, prism cells are formed to capture boundary layer substantially next to a wall of the structural component. Further, tetrahedral cells are formed to capture a diffused temperature layer substantially next to the formed last prism cell and in a direction normal to the wall. Furthermore, temperature of each of the prism cells is computed in the direction normal to the wall until a substantially first tetrahedral cell. In addition, the computed temperature of the prism cell that is substantially adjacent to the first tetrahedral cell is declared as the T. Also, the HTC is computed using the obtained T.

System and method for computing thermal boundary conditions from an unstructured CFD simulation on structural components

A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (h) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q&#x2033;) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (t) of each body part of the one or more thermal manikins using the obtained associated h, the obtained associated q&#x2033;, and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed t.

System and method for numerically evaluating thermal comfort inside an enclosure

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Bengaluru, India

Punit Tiwari