Applied Materials, Inc.

Pulkit Agarwal

Song-Moon Suh

Steven Victor Sansoni

Glen T Mori

Mei Yin Chang

Dien-Yeh Wu

Yu Lei

Xinyu Fu

Kai Wu

Wei V Tang

Kazuya Daito

Yi Xu

Sundar Ramamurthy

Jeffrey Allen Brodine

Vikash Banthia

Guoqiang Jian

Chi-Chou Lin

Daniel A Greenberg

Yuanhong Guo

Feiyue Ma

Jonathan Robert Bakke

Guangchi Xuan

Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.

Substrate support apparatus having reduced substrate particle generation

Methods for forming metal contacts having tungsten liner layers are provided herein. In some embodiments, a method of processing a substrate includes: exposing a substrate, within a first substrate process chamber, to a plasma formed from a first gas comprising a metal organic tungsten precursor gas or a fluorine-free tungsten halide precursor to deposit a tungsten liner layer, wherein the tungsten liner layer is deposited atop a dielectric layer and within a feature formed in a first surface of the dielectric layer of a substrate; transferring the substrate to a second substrate process chamber without exposing the substrate to atmosphere; and exposing the substrate to a second gas comprising a tungsten fluoride precursor to deposit a tungsten fill layer atop the tungsten liner layer.

Methods for forming low-resistance contacts through integrated process flow systems

Disclosed herein are systems and methods for cleaning a ceramic article using a stream of solid carbon dioxide (CO) particles. A method includes flowing liquid COinto a spray nozzle, and directing a first stream of solid COparticles from the spray nozzle toward a ceramic article for a first time duration to clean the ceramic article. The liquid COis converted into the first stream of solid COparticles upon exiting the spray nozzle. The first stream of solid COparticles causes a layer of solid COto be formed on the ceramic article. After the layer of solid COhas sublimated, a second stream of solid COparticles is directed from the spray nozzle toward the ceramic article for at least one of the first time duration or a second time duration to further clean the ceramic article.

Cleaning of chamber components with solid carbon dioxide particles

Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes a support member; and a plurality of substrate contact elements protruding from the support member, wherein each of the plurality of substrate contact elements includes: a first contact surface to support a substrate when placed thereon; and a second contact surface extending from the first contact surface, wherein the second contact surface is adjacent a periphery of the substrate to prevent radial movement of the substrate, wherein the first contact surface is at a first angle with respect to the support member and the second contact surface is at a second angle with respect to the support member, and wherein the first angle is between about 3 degrees and 5 degrees.

Substrate transfer robot end effector

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Santa Clara, CA, United States of America

Pulkit Agarwal