E.i. Dupont De Nemours and Company

Pui-Yan Lin

George Elias Zahr

Govindasamy Paramasivam Rajendran

Robert Anthony Marin

Joseph J Duffy

Birol Kirayoglu

Jeffrey Glenn Innocenzo

Robert J Santucci

Hanne Anna Katharina Blau

Govindasamy Paramasivan Rajendran

Robert Lee Brown

José Manuel Rodriguez-Parada

Paul J Arnold

Provided is a film having a thickness of less than 500 &#x3bc;m comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.

Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles

Quaternary ammonium bicarbonates are suitable for use as catalysts in curable epoxy compositions. The curable compositions prepared therewith are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Methods for preparation and curing are also provided. Of particular utility are compositions comprising benzytrimethyl ammonium bicarbonate. The curable composition is coated onto a first film or sheet, including a polyimide film or sheet. The coated sheet is then contacted to the surface of second film or sheet, where preferably there are discrete metallic conductive pathways disposed thereupon.

Method for preparing consolidated multi-layer article using curable epoxy composition with quaternary ammonium bicarbonate curing catalyst

Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.

Multi-layer chip carrier and process for making

Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided. The surface modified hexagonal boron nitride particles comprise surface-bonded substituted phenyl radicals.

Composite of a polymer and surface modified hexagonal boron nitride particles

Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

Filled epoxy compositions

Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.

Printed circuits prepared from filled epoxy compositions

Cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyamic acid cross-links are provided. In solution, a polymer of the invention forms a formable gel. The formable gel is useful for forming shaped articles that are useful for electronics applications.

Polyamic acid cross-linked polymer and formable composition therefrom

Provided according to the invention are cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyimide cross-links, providing a polymeric composite on a molecular scale, and shaped articles made therefrom. In some embodiments the shaped articles are particularly well suited for electronics applications. The shaped articles are characterized by low CTE (coefficient of thermal expansion), low dielectric constant (Dk), low dissipation factor (Df), high strength, high modulus and high toughness.

Polyimide cross-linked polymer and shaped article thereof

Disclosed are compositions prepared by free-radical-driven grafting onto hydrocarbons or hydrocarbon ethers of olefinically unsaturated fluorocarbons containing sulfonyl fluoride, fluorosulfonate, fluorosulfonimide, or fluorosulfonyl methide groups, wherein the grafting step is followed by a hydrolysis step in the case of sulfonyl fluoride.

Graft oligomeric electrolytes

Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.

Low loss dielectric material for printed circuit boards and integrated circuit chip packaging

The present invention relates to an apparatus and a process for a half-cell structure to make a hexagonal-cell honeycomb core. The structure has a plurality of peaks and valleys and a diagonal surface between each consecutive peak and valley. The apparatus comprises a stack holder for stacking the structure so that as one sheet is placed on top of a stack comprising at least one sheet, the peaks of one sheet contact the peaks of an adjacent sheet. The apparatus also comprises an air blower disposed beneath the top of the stack for reducing the air pressure surrounding the stack to a pressure below the air pressure on the top of the stack, thereby pressing the layers together to form the core. The present invention also relates to a transfer head and a process for holding a half-cell structure. The transfer head comprises a plurality of support bars for supporting the half-cell structure and at least one space formed between each support bar, where the width of each space is about the distance between adjacent valleys of the structure, and the depth of the space is greater than the height of the peaks.

Transfer head for holding half-cell structure

The present invention relates to an apparatus and a process for a half-cell structure to make a hexagonal-cell honeycomb core. The structure has a plurality of peaks and valleys and a diagonal surface between each consecutive peak and valley. The apparatus comprises a stack holder for stacking the structure so that as one sheet is placed on top of a stack comprising at least one sheet, the peaks of one sheet contact the peaks of an adjacent sheet. The apparatus also comprises an air blower disposed beneath the top of the stack for reducing the air pressure surrounding the stack to a pressure below the air pressure on the top of the stack, thereby pressing the layers together to form the core.

Apparatus and process for stacking sheets of half-cell structure to make

An apparatus for cutting a honeycomb half-cell structure into sheets includes a blade for cutting the structure and a conveyor for positioning a length of the half-cell structure so that the blade cuts across the diagonal surface of the half-cell structure, thereby forming the sheets. The conveyor comprises platens including a plurality of bars contacting the valleys on one side of the half-cell structure and a space between each consecutive bar. The half-cell structure is cut along the diagonal surface alternating between one side of a first predetermined bar and one side of a second predetermined bar. A process for cutting a half-cell structure into sheets includes positioning a length of the half-cell structure so that the diagonal surfaces of the structure are positioned adjacent a blade for cutting and cutting across the diagonal surface to form the sheets. A honeycomb core is made by this process, where the honeycomb core includes a plurality of sheets cut across the diagonal surface of the half-cell structure.

Apparatus and process for cutting a honeycomb half-cell structure into

The present invention relates to a process for making a hexagonal-cell honeycomb core from a honeycomb half-cell structure. The structure has a plurality of peaks and valleys on each side thereof and a diagonal surface between each consecutive peak and valley. The process comprises the steps of applying a first adhesive component, which is preferably a cyanate ester and an epoxy, to a first group of peaks and applying a second adhesive component, which is preferably the epoxy and a catalyst, to a second group of peaks. The structure is then stacked so that the first adhesive component on the first group of peaks comes into contact with the second adhesive component on the second group of peaks, thereby mixing the components to bond the half-cell structure together and form the honeycomb core.

Growing community of inventors

Hockessin, DE, United States of America

Pui-Yan Lin