Hangzhou Zhongwei Photoelectric Technology Co., Ltd.

Hangzhou Zhongwei Photoelectronic Technology Co., Ltd.

Pucha Hu

Jian Wang

Hong Li

Guangquan Zhang

Jian Jing

Jiangshui Zhang

Yongjian Fang

Zhe Liu

You Huang

Hong Chen

Xiaoying Zhu

A turnaround mechanism of silicon wafers is provided. The turnaround mechanism includes a material frame, a supporting component, a second clamping component. The frame is provided with a material tank. The supporting component includes at least one first clamping component, and each of the at least one first clamping component is configured to clamp or release a support. The second clamping component includes two first rotating shafts disposed oppositely and two second clamping members, the two first rotating shafts are rotatably connected to the material frame, the two second clamping members are correspondingly disposed on the two first rotating shafts respectively, and each of the two second clamping members can rotate with a corresponding first rotating shaft, enabling the two second clamping members to move toward each other to clamp the silicon wafers to be separated.

Turnaround mechanism of silicon wafers

The present disclosure provides a device () for degumming and inserting silicon wafers and method for processing silicon wafers. The device () for degumming and inserting silicon wafers includes a material frame (), a grabbing mechanism (), a degumming mechanism (), an unlocking mechanism () and an inserting mechanism (). The material frame () is configured for placing and clamping a plurality of silicon wafers () bonded with a support (), the grabbing mechanism () is configured for grabbing and transferring the material frame () or the support (), the degumming mechanism () is configured for degumming the plurality of silicon wafers () from the support (), the unlocking mechanism () is configured for releasing clamping and fixing of the material frame () on the plurality of silicon wafers (), and the inserting mechanism () is configured for splitting the degummed plurality of silicon wafers ().

Device for degumming and inserting silicon wafers and method for processing silicon wafers

Growing community of inventors

Hangzhou, China

Pucha Hu