Molex Corporation

Pu Xie

David L Brunker

Kirk B Peloza

Augusto P Panella

Hazelton P Avery

Li Zhuang

Dino L McLaughlin, Jr

Scott D Sommers

Andrew Kolak

Dominic Steier

Daniel Wenzel

Chia Hung Mou

Jerry Shubert

Philip J Dambach

Peerouz Amleshi

Timothy R McClelland

Teng-Kai Chen

Connector () and printed circuit board combinations include opposing electrical ground structures that increase electrical coupling. The combinations also reduce unwanted crosstalk between signals in a printed circuit board.

Connector and printed circuit board with surface ground plane

High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.

Shielded connector assemblies with temperature and alignment controls

Examples of connectors, connector assemblies, and wafer assemblies for improved shielding and thermal performance are described. In one example, a wafer assembly includes a ground path assembly and a row of conductors. The ground path assembly includes a first ground shield and a second ground shield. The row of conductors includes a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors. The first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors.

The described connector assemblies are useful in wire-to-board systems. Some assemblies include a free-end connector that is attached to a twin-ax cable, and a fixed-end connector that is attached to a board. Embodiments include a free-end terminal set including a first signal terminal, a second signal terminal and a ground plate. The ground plate has a horseshoe shape and provides a ground terminal on opposing sides of the first and second signal terminals. Additionally, embodiments include a locking system between the free-end connector and fixed-end connector, and lead designs for the fixed-end connector utilizing a similar horseshoe shape as that used for the ground plate of the free-end connector.

Connector assembly

The described connector assemblies are useful in wire-to-board systems. The assemblies which include a free-end connector that is attached to a twin-ax cable, and a fixed-end connector that is attached to a board. Embodiments include a free-end terminal set including a first signal terminal, a second signal terminal and a ground plate. The ground plate has a horseshoe shape and provides a ground terminal on opposing sides of the first and second signal terminals. Additionally, embodiments include a locking system between the free-end connector and fixed-end connector, and lead designs for the fixed-end connector utilizing a similar horseshoe shape as that used for the ground plate of the free-end connector.

A connector assembly is provided, which includes a cage that defines a port and a card slot positioned in the port. Also included is a wafer set aligned with the card slot, the wafer set including a plurality of wafers that each support at least four terminals. The terminals are arranged so that two rows of contacts are provided, one row on a first side and one row on a second side of the card slot. Each wafer of the plurality of wafers includes an insulative frame, each terminal includes a beam portion cantilevered from the insulative frame supporting that terminal, and the cantilevered beam portion of at least one terminal of the at least four terminals has a molded material thereon.

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Lisle, IL, United States of America

Pu Xie