Toranaga Technologies, Inc.

Prudeep Gandhi

Miguel Albert Capote

Catherine A Gallagher

Wesley W Walters

Hope M Viajar

Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer as the principal components. The compositions may also comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; a reactive monomer or polymer; and a metal additive. Compositions comprising metal powder are ideally suited for creating the conductive paths and vias on printed circuits.

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Del Mar, CA, United States of America

Prudeep Gandhi